10M04SAE144I7G

IC FPGA 101 I/O 144EQFP
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 101 193536 4000 144-LQFP Exposed Pad

Quantity 1,704 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFP Exposed PadNumber of I/O101Voltage2.85 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250Number of Logic Elements/Cells4000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits193536

Overview of 10M04SAE144I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC, 4,000 logic elements, 193,536-bit RAM

The 10M04SAE144I7G from Intel is a MAX® 10 FPGA implemented in a 144-LQFP exposed pad package. It integrates 4,000 logic elements, 193,536 total RAM bits and 101 I/O while operating from a 2.85 V to 3.465 V supply.

With an industrial operating temperature range of −40 °C to 100 °C and surface-mount package, this device targets embedded and industrial electronic designs that require moderate logic density, on-chip RAM capacity, and a compact package footprint.

Key Features

  • Logic Capacity  4,000 logic elements suitable for mid-density FPGA implementations.
  • On-Chip Memory  193,536 total RAM bits available for embedded data buffering and small lookup-table storage.
  • I/O  101 general-purpose I/O pins to support multiple peripheral connections and board-level interfaces.
  • Power Supply  Operates from a 2.85 V to 3.465 V supply range to match standard system rails.
  • Package & Mounting  144-LQFP exposed pad (supplier device package: 144-EQFP, 20×20) in a surface-mount format for compact board integration and thermal conduction.
  • Temperature Range  Industrial-grade operation from −40 °C to 100 °C for temperature-demanding environments.
  • Regulatory  RoHS compliant.

Unique Advantages

  • Balanced logic and memory  Combines 4,000 logic elements with 193,536 bits of RAM to support designs that need both combinational logic and on-chip data storage.
  • Ample I/O for peripheral connectivity  101 I/O pins allow flexible interfacing to sensors, controllers, and other system components without immediate need for external IO expanders.
  • Industrial temperature capability  Rated from −40 °C to 100 °C to support deployment in demanding ambient conditions.
  • Compact, serviceable package  144-LQFP exposed pad and surface-mount mounting simplify PCB layout and provide a thermal path for heat dissipation.
  • Standards-friendly supply range  2.85 V to 3.465 V operation fits common system power rails, easing power-supply design.
  • RoHS compliant  Meets common environmental compliance requirements for lead-free assembly.

Why Choose 10M04SAE144I7G?

The 10M04SAE144I7G positions itself as a mid-density, industrial-grade FPGA option from Intel that blends a practical logic element count with significant on-chip RAM and a large number of I/O. Its combination of 4,000 logic elements, 193,536 RAM bits and 101 I/O in a 144-LQFP exposed pad package provides a compact, integrable solution for embedded designs that require both logic and memory resources.

Designed for projects that need stable operation across a wide temperature range and straightforward board-level integration, this device offers a clear value proposition for engineering teams seeking a robust, RoHS-compliant FPGA with moderate capacity and flexible I/O in a surface-mount package.

Request a quote or submit an inquiry to receive pricing and availability for the 10M04SAE144I7G.

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