10M04SAE144I7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 101 193536 4000 144-LQFP Exposed Pad |
|---|---|
| Quantity | 1,704 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 101 | Voltage | 2.85 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250 | Number of Logic Elements/Cells | 4000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 193536 |
Overview of 10M04SAE144I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC, 4,000 logic elements, 193,536-bit RAM
The 10M04SAE144I7G from Intel is a MAX® 10 FPGA implemented in a 144-LQFP exposed pad package. It integrates 4,000 logic elements, 193,536 total RAM bits and 101 I/O while operating from a 2.85 V to 3.465 V supply.
With an industrial operating temperature range of −40 °C to 100 °C and surface-mount package, this device targets embedded and industrial electronic designs that require moderate logic density, on-chip RAM capacity, and a compact package footprint.
Key Features
- Logic Capacity 4,000 logic elements suitable for mid-density FPGA implementations.
- On-Chip Memory 193,536 total RAM bits available for embedded data buffering and small lookup-table storage.
- I/O 101 general-purpose I/O pins to support multiple peripheral connections and board-level interfaces.
- Power Supply Operates from a 2.85 V to 3.465 V supply range to match standard system rails.
- Package & Mounting 144-LQFP exposed pad (supplier device package: 144-EQFP, 20×20) in a surface-mount format for compact board integration and thermal conduction.
- Temperature Range Industrial-grade operation from −40 °C to 100 °C for temperature-demanding environments.
- Regulatory RoHS compliant.
Unique Advantages
- Balanced logic and memory Combines 4,000 logic elements with 193,536 bits of RAM to support designs that need both combinational logic and on-chip data storage.
- Ample I/O for peripheral connectivity 101 I/O pins allow flexible interfacing to sensors, controllers, and other system components without immediate need for external IO expanders.
- Industrial temperature capability Rated from −40 °C to 100 °C to support deployment in demanding ambient conditions.
- Compact, serviceable package 144-LQFP exposed pad and surface-mount mounting simplify PCB layout and provide a thermal path for heat dissipation.
- Standards-friendly supply range 2.85 V to 3.465 V operation fits common system power rails, easing power-supply design.
- RoHS compliant Meets common environmental compliance requirements for lead-free assembly.
Why Choose 10M04SAE144I7G?
The 10M04SAE144I7G positions itself as a mid-density, industrial-grade FPGA option from Intel that blends a practical logic element count with significant on-chip RAM and a large number of I/O. Its combination of 4,000 logic elements, 193,536 RAM bits and 101 I/O in a 144-LQFP exposed pad package provides a compact, integrable solution for embedded designs that require both logic and memory resources.
Designed for projects that need stable operation across a wide temperature range and straightforward board-level integration, this device offers a clear value proposition for engineering teams seeking a robust, RoHS-compliant FPGA with moderate capacity and flexible I/O in a surface-mount package.
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