10M04DCU324I7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 246 193536 4000 324-LFBGA |
|---|---|
| Quantity | 817 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-UBGA (15x15) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA | Number of I/O | 246 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250 | Number of Logic Elements/Cells | 4000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 193536 |
Overview of 10M04DCU324I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC 246 193536 4000 324-LFBGA
The 10M04DCU324I7G is an Intel MAX® 10 field programmable gate array (FPGA) offered in a 324-ball LFBGA package. It provides a compact, industrial‑grade programmable logic solution with defined on-chip memory, I/O capacity, and low-voltage operation.
Designed for applications requiring up to 4,000 logic elements, 193,536 bits of RAM and 246 general-purpose I/O connections, this device targets industrial systems that must operate across a −40°C to 100°C temperature range.
Key Features
- Logic Capacity — 4,000 logic elements to implement custom digital functions and small- to mid-scale designs.
- On-Chip Memory — 193,536 total RAM bits provide distributed storage for buffers, FIFOs, and small data tables.
- I/O Count — 246 I/O pins to support a wide range of external interfaces and peripheral connections.
- Power — Operates from a 1.15 V to 1.25 V supply range for low-voltage system integration.
- Package and Mounting — 324-LFBGA (supplier device package 324-UBGA, 15×15) in a surface-mount form factor for space-constrained PCBs.
- Industrial Temperature Range — Rated for −40°C to 100°C operation and designated as Industrial grade for temperature-sensitive deployments.
- Environmental Compliance — RoHS‑compliant construction for regulatory alignment in assembly and manufacturing.
Unique Advantages
- Balanced logic and memory resources: The combination of 4,000 logic elements and 193,536 RAM bits enables both control logic and on-chip data buffering without immediate need for external memory.
- High I/O density: 246 I/Os reduce the need for additional interface ICs, simplifying PCB routing for multi‑signal designs.
- Compact BGA package: The 324-LFBGA (15×15) package supports high interconnect density while minimizing PCB footprint.
- Industrial temperature tolerance: −40°C to 100°C rating supports deployment in industrial and temperature‑challenging environments.
- Low-voltage operation: 1.15–1.25 V supply range supports power-optimized system design and compatibility with modern low-voltage domains.
Why Choose 10M04DCU324I7G?
The 10M04DCU324I7G positions itself as a compact, industrial‑grade FPGA option that pairs a moderate logic element count with substantial on‑chip RAM and high I/O capacity. Its BGA packaging and surface‑mount mounting make it suitable for space-efficient boards while meeting industrial temperature requirements.
This device is appropriate for engineers specifying a programmable logic IC with defined logic, memory and I/O resources backed by Intel's MAX® 10 family identity. It delivers a clear, verifiable feature set for designs that require deterministic resource budgets and industrial temperature operation.
Request a quote or submit your requirements to receive pricing and availability information for the 10M04DCU324I7G.

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