10M04DCU324I7G

IC FPGA 246 I/O 324UBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 246 193536 4000 324-LFBGA

Quantity 817 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-UBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGANumber of I/O246Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250Number of Logic Elements/Cells4000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits193536

Overview of 10M04DCU324I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC 246 193536 4000 324-LFBGA

The 10M04DCU324I7G is an Intel MAX® 10 field programmable gate array (FPGA) offered in a 324-ball LFBGA package. It provides a compact, industrial‑grade programmable logic solution with defined on-chip memory, I/O capacity, and low-voltage operation.

Designed for applications requiring up to 4,000 logic elements, 193,536 bits of RAM and 246 general-purpose I/O connections, this device targets industrial systems that must operate across a −40°C to 100°C temperature range.

Key Features

  • Logic Capacity — 4,000 logic elements to implement custom digital functions and small- to mid-scale designs.
  • On-Chip Memory — 193,536 total RAM bits provide distributed storage for buffers, FIFOs, and small data tables.
  • I/O Count — 246 I/O pins to support a wide range of external interfaces and peripheral connections.
  • Power — Operates from a 1.15 V to 1.25 V supply range for low-voltage system integration.
  • Package and Mounting — 324-LFBGA (supplier device package 324-UBGA, 15×15) in a surface-mount form factor for space-constrained PCBs.
  • Industrial Temperature Range — Rated for −40°C to 100°C operation and designated as Industrial grade for temperature-sensitive deployments.
  • Environmental Compliance — RoHS‑compliant construction for regulatory alignment in assembly and manufacturing.

Unique Advantages

  • Balanced logic and memory resources: The combination of 4,000 logic elements and 193,536 RAM bits enables both control logic and on-chip data buffering without immediate need for external memory.
  • High I/O density: 246 I/Os reduce the need for additional interface ICs, simplifying PCB routing for multi‑signal designs.
  • Compact BGA package: The 324-LFBGA (15×15) package supports high interconnect density while minimizing PCB footprint.
  • Industrial temperature tolerance: −40°C to 100°C rating supports deployment in industrial and temperature‑challenging environments.
  • Low-voltage operation: 1.15–1.25 V supply range supports power-optimized system design and compatibility with modern low-voltage domains.

Why Choose 10M04DCU324I7G?

The 10M04DCU324I7G positions itself as a compact, industrial‑grade FPGA option that pairs a moderate logic element count with substantial on‑chip RAM and high I/O capacity. Its BGA packaging and surface‑mount mounting make it suitable for space-efficient boards while meeting industrial temperature requirements.

This device is appropriate for engineers specifying a programmable logic IC with defined logic, memory and I/O resources backed by Intel's MAX® 10 family identity. It delivers a clear, verifiable feature set for designs that require deterministic resource budgets and industrial temperature operation.

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