10M04DCU324A7G

The 10M04DCU324A7G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 324-LFBGA package. It provides a compact, automotive-qualified FPGA platform combining logic, on-chip RAM, and a high I/O count for embedded designs.

With 4,000 logic elements, 193,536 bits of RAM and 246 I/O, this device targets designs that require moderate programmable logic density, substantial on-chip memory, and robust operating conditions, including AEC-Q100 automotive qualification and a wide operating temperature range.

Key Features

• Logic Capacity — 4,000 logic elements for implementing custom digital logic and moderate-complexity functions.
• On-Chip Memory — 193,536 total RAM bits to support buffering, state storage, and small lookup tables without external memory.
• I/O Density — 246 I/O pins to accommodate multiple peripheral interfaces and signal routing within a compact footprint.
• Automotive Qualification — AEC-Q100 qualification and listed as Automotive grade for deployment in automotive electronics.
• Wide Operating Temperature — Specified operation from −40°C to 125°C to meet demanding thermal environments.
• Supply Voltage — Core voltage range from 1.15 V to 1.25 V for system power planning and compatibility with low-voltage domains.
• Package & Mounting — 324-LFBGA (supplier package 324-UBGA, 15 × 15 mm) in a surface-mount form factor for space-constrained boards.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Automotive systems — AEC-Q100 qualification and −40°C to 125°C operation make this device suitable for automotive electronic control units and related subsystems.
• Embedded control and signal processing — 4,000 logic elements and significant on-chip RAM enable custom control logic and intermediate signal buffering in embedded products.
• High-density I/O hubs — 246 I/O pins support designs that consolidate multiple sensor, actuator, or peripheral interfaces.

Unique Advantages

• Automotive-ready platform: AEC-Q100 qualification combined with a wide temperature range supports deployment in vehicle-grade applications.
• Balanced logic and memory: 4,000 logic elements plus 193,536 bits of RAM provide on-chip resources for compact, integrated designs without immediate external memory needs.
• High I/O flexibility: 246 I/O pins enable flexible interfacing to sensors, buses, and peripherals while minimizing external bridge components.
• Space-efficient packaging: 324-LFBGA (15 × 15 mm UBGA) surface-mount package offers a compact footprint for constrained PCBs.
• Low-voltage core: 1.15 V to 1.25 V supply range assists in power budgeting for modern low-voltage systems.
• Standards and compliance: RoHS compliance supports regulatory and manufacturing requirements for many markets.

Why Choose 10M04DCU324A7G?

The 10M04DCU324A7G is positioned for engineers who need an automotive-qualified, mid-density FPGA with substantial on-chip RAM and a high I/O count in a compact LFBGA package. Its combination of 4,000 logic elements, 193,536 bits of RAM, and 246 I/O pins provides a balanced platform for embedded control, I/O consolidation, and moderate-complexity programmable logic tasks.

Choose this device when your design requires automotive-grade qualification, wide temperature operation, and a compact surface-mount FPGA solution that integrates logic and memory resources for streamlined system design and reduced external component count.

Request a quote or submit an RFQ today to get pricing and availability for the 10M04DCU324A7G.