10M04DCF256C7G

The 10M04DCF256C7G is an Intel MAX® 10 field programmable gate array (FPGA) device in a 256-LBGA package. It provides 4,000 logic elements, 193,536 bits of on-chip RAM, and up to 178 I/O, delivering moderate logic capacity with substantial embedded memory in a compact surface-mount BGA.

Targeted for commercial-grade designs, this MAX 10 device operates from a 1.15 V to 1.25 V supply and is specified for an operating temperature range of 0 °C to 85 °C, making it suitable for systems that require on-chip RAM, flexible I/O, and a small-board footprint.

Key Features

• Core Logic  4,000 logic elements provide the programmable fabric for implementing custom logic, control, and glue functions.
• On-chip Memory  193,536 total RAM bits for buffering, state storage, and data processing without external memory.
• I/O Capacity  Up to 178 I/O pins to support dense peripheral interfacing and flexible signal routing.
• Power  Core voltage supply range of 1.15 V to 1.25 V to match system power rails and design constraints.
• Package & Mounting  256-LBGA package (supplier device package: 256-FBGA 17×17) in a surface-mount form factor for compact PCB integration.
• Commercial Grade  Specified for commercial operation with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
• MAX 10 Family  Part of the Intel MAX 10 FPGA family (commercial speed grade -C7 as indicated by the device suffix).

Typical Applications

• I/O-rich control systems  Designs that require extensive peripheral interfacing can leverage the device’s 178 I/O for sensors, actuators, and external logic connections.
• On-chip buffering and data handling  Use the 193,536 bits of embedded RAM for frame buffering, FIFOs, and intermediate data storage without immediate external memory.
• Custom logic and glue  Implement protocol bridging, timing control, and glue logic within the 4,000 logic elements to simplify system BOM and board routing.
• Compact, surface-mount designs  The 256-LBGA surface-mount package allows integration into space-constrained PCBs while maintaining significant logic and memory resources.

Unique Advantages

• High I/O density: 178 available I/O pins provide flexible interfacing options for mixed-signal and multi-peripheral systems.
• Substantial on-chip memory: 193,536 bits of RAM reduce dependence on external memory for many buffering and state-storage tasks.
• Balanced logic capacity: 4,000 logic elements deliver moderate programmable logic resources for control, glue, and data-path functions.
• Compact BGA footprint: 256-LBGA (256-FBGA 17×17) enables high-density board layouts while maintaining surface-mount manufacturing compatibility.
• Low-voltage core: 1.15 V to 1.25 V supply window aligns with modern low-voltage power rails.
• Commercial-ready and compliant: Commercial grade with 0 °C to 85 °C operating range and RoHS compliance for standard electronics markets.

Why Choose 10M04DCF256C7G?

The 10M04DCF256C7G combines a practical balance of logic, memory, and I/O in a compact 256-LBGA package, making it well suited for commercial designs that need moderate programmable logic alongside significant on-chip RAM. Its 1.15 V–1.25 V core supply and 0 °C–85 °C operating range match common system power and environmental requirements.

Choose this MAX 10 FPGA when you need integrated memory and flexible I/O in a surface-mount BGA form factor, and when a commercial-grade, RoHS-compliant programmable device fits your application and procurement needs.

Request a quote for 10M04DCF256C7G or submit a quote through your preferred procurement channel to evaluate this device for your next design.