10M04DAF256I7G

The 10M04DAF256I7G is an Intel MAX® 10 FPGA in a 256-ball BGA package designed for industrial applications. It integrates 4,000 logic elements, 193,536 bits of on-chip RAM, and 178 general-purpose I/O to support compact, programmable logic implementations.

Engineered for surface-mount assembly, this device operates from a 1.15 V to 1.25 V core supply and across an industrial temperature range of −40 °C to 100 °C. The device complies with RoHS environmental standards.

Key Features

• Logic Capacity  4,000 logic elements for implementing combinational and sequential logic in a compact FPGA.
• On-Chip Memory  193,536 total RAM bits to support data buffering, FIFOs, and small memory structures without external RAM.
• I/O Density  178 I/O pins to accommodate multiple peripheral interfaces and signal requirements within a single device.
• Package & Mounting  256-LBGA package case; supplier device package listed as 256-FBGA (17×17). Surface-mount construction suitable for automated PCB assembly.
• Power  Core supply voltage range of 1.15 V to 1.25 V, enabling defined power planning for the programmable core.
• Operating Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant for electronics manufacturing and environmental requirements.

Unique Advantages

• Balanced integration: Combines 4,000 logic elements and 193,536 bits of RAM to reduce external components for mid-density programmable designs.
• High I/O count: 178 I/O pins enable flexible connectivity for multiple sensors, peripherals, and control interfaces without additional I/O expanders.
• Compact BGA footprint: 256-ball BGA (256-FBGA, 17×17) provides a high pin-count solution in a small PCB area for space-constrained systems.
• Industrial temperature capability: Specified −40 °C to 100 °C operation supports deployments in demanding environmental conditions.
• Defined core voltage: Narrow 1.15 V–1.25 V supply simplifies power-supply design and margin analysis.
• RoHS compliant: Supports regulatory and manufacturing requirements for lead-free assembly.

Why Choose 10M04DAF256I7G?

The 10M04DAF256I7G delivers a well-balanced mix of logic, on-chip memory, and I/O density in a compact industrial-grade BGA package. It is suited to engineers seeking a mid-density programmable device with clear electrical and thermal limits for reliable operation across a wide temperature range.

With its combination of 4,000 logic elements, substantial on-chip RAM, and 178 I/O, this MAX® 10 device is appropriate for designers who need integrated logic and memory resources with a small board footprint and RoHS-compliant manufacturing.

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