10M02SCU324C8G

The 10M02SCU324C8G is a MAX® 10 field programmable gate array (FPGA) in a 324-ball LFBGA package, offering integrated programmable logic, embedded RAM, and a high-density I/O count. This device targets compact embedded and control designs that require on-chip logic, memory resources, and broad I/O connectivity within a commercial temperature range.

With 2,000 logic elements, 110,592 total RAM bits, and up to 246 I/Os, the device delivers a balanced mix of logic, memory, and interfacing capability while operating from a 2.85 V to 3.465 V supply and a 0 °C to 85 °C temperature range.

Key Features

• Core Logic  2000 logic elements provide the programmable fabric for custom combinational and sequential logic implementations.
• On‑Chip Memory  110,592 bits of total RAM enable local buffering, state storage, and small embedded memory arrays without external RAM.
• I/O Density  Up to 246 general-purpose I/Os support dense peripheral interfacing and multiple parallel signal paths.
• Package & Mounting  324-LFBGA (supplier package: 324-UBGA, 15×15 mm) in a surface-mount format for compact board integration.
• Power  Wide supply range of 2.85 V to 3.465 V to accommodate common power rails in commercial systems.
• Temperature Rating  Commercial operating range: 0 °C to 85 °C for typical consumer and commercial embedded applications.
• Compliance  RoHS compliant to support modern regulatory and manufacturing requirements.

Typical Applications

• Embedded Control  Leverage on‑chip logic and RAM to implement compact control state machines, protocol handling, and glue-logic within constrained board space.
• Sensor and I/O Aggregation  High I/O count supports interfacing multiple sensors, ADCs/DACs, and discrete signals for data collection and preprocessing.
• Human-Machine Interfaces  Use the available logic and I/O to manage displays, key matrices, and touch or button interfaces in consumer and commercial products.
• Custom Peripherals  Implement small custom accelerators, data formatting, or protocol translation functions using embedded RAM and programmable logic.

Unique Advantages

• Balanced Logic and Memory:  2,000 logic elements paired with 110,592 RAM bits let designers partition functions between logic fabric and local memory without external components.
• High I/O Count:  246 I/Os reduce the need for additional interface chips, simplifying BOM and board routing for multi-signal applications.
• Compact, Surface‑Mount Package:  324-LFBGA (324-UBGA, 15×15) enables dense PCB layouts while maintaining robust electrical connections.
• Flexible Power Range:  Support for 2.85 V to 3.465 V supplies makes integration straightforward with common system rails.
• Commercial Temperature Coverage:  Rated 0 °C to 85 °C for designs targeting consumer and general commercial markets.
• Regulatory Compliance:  RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 10M02SCU324C8G?

The 10M02SCU324C8G offers a practical combination of logic, embedded memory, and I/O capacity in a compact BGA package, making it well suited for space-constrained commercial applications that require on-chip processing and broad interfacing. Its electrical and package specifications simplify board-level integration and support common supply rails.

This part is a good fit for engineers and procurement teams designing small to medium-scale programmable logic solutions who need predictable, documented specifications for logic capacity, RAM, I/O, supply range, and operating temperature.

Request a quote or submit an inquiry for pricing and availability to evaluate the 10M02SCU324C8G for your next design.