10M02SCM153I7G

The 10M02SCM153I7G is a MAX® 10 Field Programmable Gate Array (FPGA) from Intel, delivered in a 153-ball VFBGA package. It provides reprogrammable logic resources, embedded memory, and a substantial I/O count for configurable digital designs.

With 2,000 logic elements, 110,592 total RAM bits and 112 I/O pins, this industrial-grade device targets applications that require on-board configurability and operation across a wide temperature range. The device operates from a 2.85 V to 3.465 V supply and is RoHS compliant.

Key Features

• Core Logic 2,000 logic elements for implementing custom digital functions and small to medium-scale logic integration.
• Embedded Memory 110,592 total RAM bits to support data buffering, state machines, and on-chip storage needs.
• I/O Capacity 112 user I/Os to interface with sensors, peripherals, and external devices or subsystems.
• Package 153-VFBGA package (supplier device package: 153-MBGA 8×8) optimized for surface-mount assembly.
• Power Voltage supply range of 2.85 V to 3.465 V to match a variety of system power rails.
• Thermal and Mechanical Industrial operating temperature range from −40 °C to 100 °C and surface-mount mounting type for board-level integration.
• Environmental Compliance RoHS compliant for reduced hazardous substance content.

Typical Applications

• Industrial Automation — Implement control logic, input/output aggregation, and protocol bridging while operating across industrial temperature ranges.
• Embedded Systems — Provide reconfigurable logic and on-chip memory for custom peripherals, glue logic, and control functions within embedded designs.
• Communications and Interfaces — Use the device’s 112 I/Os and embedded RAM to handle protocol adaptors, buffering, and I/O management tasks.

Unique Advantages

• Reconfigurable Logic: 2,000 logic elements allow designers to implement and iterate custom digital functions without changes to PCB hardware.
• Substantial On-Chip Memory: 110,592 RAM bits enable local data storage and buffering, reducing the need for external memory in many designs.
• High I/O Count: 112 I/Os support extensive sensor, peripheral, and bus connectivity directly from the FPGA package.
• Industrial Readiness: Rated for −40 °C to 100 °C operation, suitable for deployment in temperature-challenging environments.
• Compact Surface-Mount Package: 153-ball VFBGA (153-MBGA 8×8) minimizes PCB footprint while supporting board-level assembly processes.
• RoHS Compliance: Meets environmental substance regulations for many commercial and industrial product lines.

Why Choose 10M02SCM153I7G?

The 10M02SCM153I7G balances reprogrammable logic capacity, embedded memory, and a high I/O count in a compact industrial-grade package. Its electrical and thermal specifications make it a practical choice for engineers building configurable digital subsystems that must operate reliably across a wide temperature range.

Manufactured by Intel, this MAX® 10 FPGA is suited for customers who need a field-programmable device with moderate logic density, on-chip RAM, and extensive I/O for embedded, industrial, or communications-oriented designs—while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the 10M02SCM153I7G. Our team can provide lead-time and ordering information to support your design schedule.