10M02SCE144C8G

The 10M02SCE144C8G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 144-LQFP exposed pad package. It provides a compact, surface-mount FPGA option with 2,000 logic elements, 110,592 bits of embedded RAM and 101 user I/O pins.

Designed for commercial-temperature embedded designs, this device operates from a 2.85 V to 3.465 V supply and is specified for 0 °C to 85 °C, making it suitable for a broad range of general-purpose control, interface and glue-logic applications where moderate logic density and on-chip RAM are required.

Key Features

• Core Logic: 2,000 logic elements and 125 logic array blocks provide the programmable fabric for implementing custom digital functions and glue logic.
• Memory: 110,592 bits of total on-chip RAM to store FIFOs, small buffers or state data without external memory.
• I/O Capacity: 101 user I/O pins to support multiple interfaces, GPIO and peripheral connections in a single-package solution.
• Package & Mounting: 144-LQFP exposed pad (supplier device package: 144-EQFP, 20 × 20) in a surface-mount form factor to ease board-level integration and thermal conduction via the exposed pad.
• Power: Specified operating supply range of 2.85 V to 3.465 V to match common system rails.
• Temperature & Grade: Commercial grade operation across 0 °C to 85 °C for typical consumer and industrial-adjacent applications.
• Environmental Compliance: RoHS compliant for assembly and end-product regulatory needs.

Typical Applications

• Embedded Control: Implement control logic and state machines using the device’s 2,000 logic elements and on-chip RAM for local storage.
• Interface and Glue Logic: Consolidate multiple interface buffers and protocol adaptors using the 101 I/O pins to reduce board-level component count.
• Human-Machine Interfaces: Drive and manage displays, buttons and peripheral sensors where moderate I/O and on-chip memory are required.

Unique Advantages

• Right-sized Logic Density: 2,000 logic elements deliver sufficient capability for control, interface and small-scale datapath designs without over-specifying resources.
• Integrated RAM: 110,592 bits of on-chip RAM reduce reliance on external memory, simplifying BOM and board routing.
• Generous I/O Count: 101 I/O pins allow flexible connectivity to peripherals and multiple interfaces from a single device.
• Compact Surface-Mount Package: The 144-LQFP exposed pad package supports compact PCB layouts and improved thermal path for the device.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C to match standard commercial product requirements.
• RoHS Compliant: Meets RoHS requirements to support restricted-substance compliance in assemblies.

Why Choose 10M02SCE144C8G?

The 10M02SCE144C8G positions itself as a compact, commercially graded FPGA option that balances logic capacity, on-chip RAM and I/O count in a single surface-mount package. It is well suited to designers who need embedded programmable logic for control, interface consolidation or HMI tasks while maintaining a small board footprint and standard supply voltage compatibility.

Backed by Intel’s MAX® 10 family designation and RoHS compliance, this device offers a straightforward migration path for projects that require modest logic resources, integrated RAM, and a 144-LQFP exposed pad package for efficient PCB integration.

Request a quote or submit an inquiry to obtain pricing and availability for the 10M02SCE144C8G and to discuss volume or delivery options for your design needs.