10M02SCE144A7G

The 10M02SCE144A7G is an Intel MAX® 10 field programmable gate array (FPGA) device featuring 2,000 logic elements and 110,592 bits of on-chip RAM. It provides 101 general-purpose I/O and is supplied in a 144-LQFP exposed-pad package (144‑EQFP, 20×20) for compact, surface-mount board designs.

Designed and qualified for automotive use (AEC-Q100), this device supports operation from -40 °C to 125 °C and a supply voltage range of 2.85 V to 3.465 V, making it suitable for embedded and in-vehicle applications that require moderate logic density with integrated memory and flexible I/O.

Key Features

• Core Logic  2,000 logic elements for implementing custom digital functions and control logic.
• On-chip Memory  110,592 bits of RAM for FIFOs, buffers, and small data storage directly on the FPGA fabric.
• I/O Count  101 I/O pins to support multiple peripheral interfaces and sensor connections.
• Package  144-LQFP exposed pad (supplier package: 144‑EQFP, 20×20) optimized for surface-mount assembly and thermal performance.
• Automotive Qualification  Grade: Automotive with AEC-Q100 qualification for designs that require automotive component acceptance.
• Temperature Range  Operating range from -40 °C to 125 °C for deployment in harsh and wide-temperature environments.
• Supply Voltage  Standard I/O/core supply window of 2.85 V to 3.465 V for common automotive and embedded power rails.
• Mounting & Compliance  Surface-mount device with RoHS compliance for modern manufacturing and environmental requirements.

Typical Applications

• Automotive Control Systems  Use as a compact, qualified FPGA for vehicle control modules, gateway logic, and interface consolidation where AEC-Q100 qualification and extended temperature are required.
• Embedded I/O Aggregation  Consolidate multiple sensors and peripheral interfaces using the device’s 101 I/Os and on-chip RAM to reduce external components.
• Industrial and Harsh-Environment Electronics  Deploy in equipment that requires operation across -40 °C to 125 °C and automotive-grade component reliability.

Unique Advantages

• Automotive-ready Qualification: AEC-Q100 qualification and automotive grade provide documented suitability for in-vehicle and similarly demanding applications.
• Compact, Thermally Efficient Package: 144-LQFP exposed pad (20×20) balances board-area efficiency with improved thermal dissipation for surface-mount designs.
• Integrated Memory Capacity: 110,592 bits of on-chip RAM enable local buffering and state storage without adding external memory chips.
• Ample I/O for Peripheral Integration: 101 I/Os simplify interfacing to sensors, actuators, and external controllers, reducing system BOM.
• Wide Operating Range: Supply voltage from 2.85 V to 3.465 V and -40 °C to 125 °C operation support a range of automotive and embedded power and thermal environments.
• Regulatory Compliance: RoHS compliance facilitates deployment in designs targeting regulated markets.

Why Choose 10M02SCE144A7G?

The 10M02SCE144A7G balances moderate logic capacity with significant on-chip memory and a high I/O count in a compact, automotive-qualified package. It is well suited for embedded and in-vehicle designs that require certified components, extended temperature operation, and consolidated I/O and memory functions to reduce system complexity.

As part of the Intel MAX 10 family, this device provides a clear specification set—logic elements, RAM bits, I/O count, package, supply range, and AEC-Q100 qualification—so designers can select this part when those concrete capabilities align with project requirements for robustness and integration.

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