10M02DCU324I7G

The 10M02DCU324I7G is an Intel MAX® 10 FPGA supplied in a 324-LFBGA (324-UBGA, 15×15) surface-mount package. This industrial-grade FPGA integrates programmable logic, on-chip RAM, and a high count of general-purpose I/O to support embedded and control-oriented designs.

Key device characteristics include 2,000 logic elements, 110,592 total RAM bits, 160 I/O pins, a 1.15 V–1.25 V core supply range, and an operating temperature range of −40 °C to 100 °C, making it suited to applications where I/O density, low-voltage operation, and extended temperature handling are required.

Key Features

• Logic Capacity  Provides 2,000 logic elements to implement custom combinational and sequential logic functions.
• On‑Chip Memory  110,592 total RAM bits for buffering, small data stores, and state retention inside the FPGA fabric.
• I/O Resources  160 I/O pins to support multiple peripheral interfaces, parallel connections, and board-level signal routing.
• Power and Voltage  Core supply range of 1.15 V to 1.25 V to match low‑voltage system power rails.
• Package and Mounting  324-LFBGA (324-UBGA, 15×15) surface-mount package for compact PCB integration.
• Industrial Grade Temperature  Rated for −40 °C to 100 °C operation, appropriate for industrial temperature environments.
• Standards Compliance  RoHS‑compliant construction for regulatory and environmental compatibility.

Typical Applications

• Industrial Control  Implement custom control logic, sequencing, and interface glue in industrial automation systems that require extended temperature operation.
• I/O Expansion and Bridging  Use the device’s 160 I/O pins to aggregate or translate between multiple board-level peripherals and interfaces.
• Embedded System Logic  Offload deterministic logic, state machines, and protocol handling from microcontrollers using the on‑chip logic and RAM.
• Compact FPGA Deployments  Deploy low‑to‑moderate density programmable logic in space‑constrained designs thanks to the 324‑LFBGA packaging.

Unique Advantages

• Balanced Logic and Memory:  2,000 logic elements combined with 110,592 RAM bits provide a balanced resource mix for control and buffering tasks without external memory.
• High I/O Count:  160 I/O pins enable flexible system interfacing and reduce the need for external multiplexing components.
• Industrial Temperature Rating:  Operation from −40 °C to 100 °C supports deployments in harsher ambient conditions.
• Low‑Voltage Core:  1.15 V–1.25 V supply range aligns with modern low‑voltage power architectures to simplify power‑rail design.
• Compact Surface‑Mount Package:  324‑LFBGA (15×15) packaging offers a compact footprint for high‑density PCB layouts.
• Regulatory Compliance:  RoHS compliance supports environmentally conscious designs and supply requirements.

Why Choose 10M02DCU324I7G?

The 10M02DCU324I7G is positioned for designs that require a compact, industrial‑rated FPGA with a practical mix of logic, on‑chip RAM, and abundant I/O. Its 324‑LFBGA package, low core voltage range, and extended operating temperature make it a fit for embedded control, I/O‑intensive modules, and industrial electronics where board space and thermal range matter.

For engineering teams seeking a field‑programmable device that delivers verifiable resources (2,000 logic elements, 110,592 RAM bits, 160 I/O) and RoHS compliance, this MAX® 10 device provides a clear, specification‑driven choice that integrates into low‑voltage industrial designs.

Request a quote or submit your requirements to receive pricing and availability information for the 10M02DCU324I7G. Our team will respond with a tailored quote and delivery lead times.