10M02DCU324C8G

The 10M02DCU324C8G is an Intel MAX® 10 field programmable gate array supplied in a 324-LFBGA package. It provides a moderate-density, commercially graded programmable logic solution with on-chip RAM and a high I/O count suited to commercial embedded designs.

With 2,000 logic elements, 110,592 bits of total RAM and 160 I/O pins, this surface-mount FPGA is designed for applications that require configurable logic, integrated memory and a compact BGA package while operating within standard commercial temperature and supply ranges.

Key Features

• Core Logic  2,000 logic elements for implementing configurable digital logic and control functions.
• On-chip Memory  110,592 total RAM bits to support data buffering, state machines and small local memories.
• I/O Capacity  160 I/O pins to support multiple interfaces, sensors and peripheral connections in compact designs.
• Package and Mounting  324-LFBGA supplier device package (324-UBGA, 15 × 15 mm) in a surface-mount form factor for PCB space-efficient deployment.
• Power  Core voltage supply range of 1.15 V to 1.25 V to match system power domains.
• Thermal and Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS-compliant construction for regulatory and manufacturing compatibility.
• Documentation  Intel MAX 10 device datasheet covers electrical characteristics, switching characteristics, configuration and timing specifications.

Typical Applications

• Commercial Embedded Control  Use the FPGA to implement custom control logic, protocol bridges or glue logic in commercial electronic products.
• Peripheral and Interface Integration  Leverage the 160 I/Os to consolidate multiple peripheral interfaces and simplify board-level routing.
• On-board Memory Acceleration  Employ the built-in RAM (110,592 bits) for buffering, packet handling or small lookup tables without external memory.
• Compact PCB Designs  The 324-LFBGA (15 × 15 mm) package supports high-density integration where board area is constrained.

Unique Advantages

• Balanced Logic Density:  2,000 logic elements provide a compact yet capable resource set for moderate-complexity designs.
• Integrated Memory Resources:  110,592 bits of on-chip RAM reduce the need for external memory and lower BOM complexity.
• High I/O Count in a Small Package:  160 I/Os in a 324-LFBGA (15 × 15) enable multiple interfaces while maintaining a small PCB footprint.
• Commercial Temperature Rating:  0 °C to 85 °C operation aligns with a wide range of commercial deployments.
• RoHS Compliance:  Meets environmental and manufacturing requirements for lead-free production flows.
• Single-Supplier Source:  Manufactured by Intel, with comprehensive device-level documentation for electrical and timing specifications.

Why Choose 10M02DCU324C8G?

The 10M02DCU324C8G delivers a practical combination of logic, memory and I/O density in a compact LFBGA package for commercial applications. Its 2,000 logic elements, substantial on-chip RAM and 160 I/Os make it well suited for designers who need to consolidate interfaces and implement custom logic without expanding board area or part count.

Backed by Intel MAX 10 device documentation covering electrical, switching and configuration characteristics, this FPGA provides a verifiable, RoHS-compliant option for commercial embedded designs that require predictable operating conditions and reliable integration.

If you would like pricing, availability or a formal quote for the 10M02DCU324C8G, submit a request for a quote or a pricing inquiry today.