10M02DCU324A7G

The 10M02DCU324A7G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel supplied in a 324-LFBGA package. It provides a compact, automotive-grade programmable logic solution with 2,000 logic elements, 110,592 bits of on-chip RAM and up to 160 user I/Os.

Designed for applications that require automotive qualification and wide temperature operation, this surface-mount FPGA supports a 1.15 V to 1.25 V core supply and is qualified to AEC-Q100. RoHS compliance and a -40 °C to 125 °C operating range make it suitable for harsh environments.

Key Features

• Core Logic — 2,000 logic elements supporting user-configurable digital functions for control, glue logic, and custom processing.
• On-Chip Memory — 110,592 total RAM bits for buffering, FIFOs, and small data structures without external memory.
• I/O Capacity — Up to 160 user I/Os to interface with sensors, peripherals, and other system components.
• Power — Core voltage supply range of 1.15 V to 1.25 V to match system power rails and design constraints.
• Package — 324-LFBGA (supplier device package: 324-UBGA, 15×15) providing a compact BGA footprint for space-constrained designs.
• Automotive Qualification & Temperature — AEC-Q100 qualification and an operating range of -40 °C to 125 °C for deployment in automotive-grade environments.
• Mounting & Compliance — Surface-mount device with RoHS compliance for modern production processes and environmental requirements.

Typical Applications

• Automotive systems — Use as programmable logic in automotive subsystems where AEC-Q100 qualification and wide temperature range are required.
• Embedded control — Consolidate control and I/O handling using on-chip logic and 160 I/Os to reduce external components.
• Data buffering and preprocessing — Leverage 110,592 bits of RAM for temporary storage, buffering, or small-scale data manipulation close to sensors or ADCs.

Unique Advantages

• Automotive-qualified reliability: AEC-Q100 qualification and a -40 °C to 125 °C rating provide confidence for vehicle-level deployments.
• Compact, high-density package: 324-LFBGA (324-UBGA, 15×15) offers a small footprint for space-constrained PCB designs.
• Balanced logic and memory: 2,000 logic elements combined with 110,592 bits of RAM enable a range of control, interfacing, and buffering tasks without external memory.
• Ample I/O count: 160 available I/Os simplify direct connections to sensors, actuators, and peripheral devices.
• Controlled power envelope: Narrow core supply range (1.15 V to 1.25 V) helps maintain predictable power budgeting in the system design.
• RoHS compliant surface-mount device: Fits modern manufacturing flows and environmental standards.

Why Choose 10M02DCU324A7G?

The 10M02DCU324A7G positions itself as a compact, automotive-grade FPGA option that combines moderate logic density, substantial on-chip RAM, and a high I/O count in a small BGA package. Its AEC-Q100 qualification and extended temperature range make it a practical choice for designers targeting automotive and other thermally demanding embedded applications.

Backed by Intel manufacturing, this MAX® 10 device is suitable for designs that need reliable, qualified programmable logic with on-chip memory and flexible I/O in a surface-mount form factor, enabling streamlined BOMs and robust system-level integration.

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