10M02DCV36C7G

IC FPGA 27 I/O 36WLCSP
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 27 110592 2000 36-UFBGA, WLCSP

Quantity 755 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package36-VBGA (3.47x3.4)GradeCommercialOperating Temperature0°C – 85°C
Package / Case36-UFBGA, WLCSPNumber of I/O27Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs125Number of Logic Elements/Cells2000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of 10M02DCV36C7G – MAX® 10 FPGA (2000 logic elements, 110,592 RAM bits, 36‑UFBGA)

The 10M02DCV36C7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) in a compact 36‑UFBGA/WLCSP package. It provides 2,000 logic elements, 125 logic array blocks (LABs), and 110,592 total RAM bits for integrated programmable logic and on‑chip memory.

Configured for commercial‑grade applications, this device offers 27 I/O, a low‑voltage core supply range of 1.15–1.25 V, surface‑mount packaging (supplier package: 36‑VBGA, 3.47 × 3.4 mm), an operating range of 0 °C to 85 °C, and RoHS compliance.

Key Features

  • Logic Capacity — 2,000 logic elements and 125 logic array blocks (LABs) provide programmable logic resources for control and glue‑logic functions.
  • On‑Chip Memory — 110,592 total RAM bits available for data buffering, small FIFOs, and state storage.
  • I/O — 27 general‑purpose I/O pins for peripheral interfacing and signal routing.
  • Power — Core supply range of 1.15 V to 1.25 V to support low‑voltage system designs.
  • Package & Mounting — 36‑UFBGA, WLCSP package (supplier package: 36‑VBGA, 3.47 × 3.4 mm); surface‑mount for compact board layouts.
  • Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C and supported speed grade -C7.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Embedded Control — Moderate logic capacity and on‑chip RAM make the device suitable for control and coordination tasks in commercial embedded systems.
  • Peripheral and Interface Logic — 27 I/O pins provide connectivity for signaling, protocol bridging, and glue‑logic between components.
  • Data Buffering and State Management — On‑chip RAM supports buffering, small FIFO implementations, and local state storage.
  • Compact Board Designs — WLCSP/36‑VBGA packaging enables space‑constrained PCB layouts where small footprint is required.

Unique Advantages

  • Compact integration: The 36‑UFBGA / WLCSP (36‑VBGA, 3.47 × 3.4 mm) package reduces PCB area for space‑limited designs.
  • Balanced logic and memory: 2,000 logic elements paired with 110,592 RAM bits lets you implement both logic functions and local data storage on a single device.
  • Low‑voltage operation: 1.15–1.25 V core supply supports designs targeting lower power domains.
  • Commercial deployment ready: Rated for 0 °C to 85 °C operation and provided as a commercial‑grade (-C7) device.
  • RoHS compliant: Meets environmental restrictions for lead‑free manufacturing processes.

Why Choose 10M02DCV36C7G?

The 10M02DCV36C7G positions itself as a compact, commercially graded FPGA option that combines a practical logic element count with substantial on‑chip RAM and a small WLCSP footprint. Its 27 I/O and low‑voltage core range make it appropriate for embedded designs that require integrated logic, buffering, and a minimal PCB area.

This device is well suited to teams and projects that need a commercially rated FPGA with verified electrical characteristics and environmental compliance, providing a balance of integration and predictable operational limits for commercial applications.

Request a quote or submit an inquiry to receive pricing and availability information for the 10M02DCV36C7G.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up