10CX220YU484E6G
| Part Description |
Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 13752320 220000 484-BFBGA |
|---|---|
| Quantity | 384 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA | Number of I/O | 188 | Voltage | 900 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80330 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13752320 |
Overview of 10CX220YU484E6G – Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 13752320 220000 484-BFBGA
The 10CX220YU484E6G is an Intel Cyclone® 10 GX field-programmable gate array (FPGA) in a 484-ball BFBGA package. It delivers a high-density logic fabric with on-chip RAM and a broad set of configuration and I/O timing specifications intended for embedded and system-level FPGA designs.
This device is offered in an Extended grade and is presented in a 484-UBGA (19×19) package for surface-mount assembly. The accompanying datasheet documents electrical characteristics, switching and transceiver performance, configuration schemes, and I/O timing for system integration and design validation.
Key Features
- Logic Capacity — 220,000 logic elements (cells) for implementing complex digital logic, state machines, and custom accelerators.
- On-chip Memory — 13,752,320 total RAM bits to support buffering, packet processing, and local data storage within the FPGA fabric.
- I/O Count & Package — 188 I/O pins in a 484-BFBGA package (supplier package: 484-UBGA, 19×19) optimized for compact board designs and high pin-count requirements.
- Power — Core supply voltage specified at 900 mV.
- Mounting & Compliance — Surface mount device with RoHS compliance for modern manufacturing and environmental requirements.
- Operating Temperature Range — Rated for 0 °C to 100 °C operation suitable for a range of commercial and extended-temperature applications.
- Configuration & Timing Documentation — Datasheet includes configuration specifications and I/O timing (JTAG, FPP, AS, PS configuration schemes are documented), plus electrical and switching characteristics to support system integration.
Typical Applications
- High-density digital processing — Implement compute-heavy logic blocks, protocol handlers, and bespoke datapaths using the device’s 220,000 logic elements and large on-chip RAM.
- Network and packet processing — Utilize the fabric and RAM capacity for buffering, parsing, and packet-level operations where deterministic FPGA-based processing is required.
- Embedded system control — Integrate peripheral interfaces and custom control logic in a compact surface-mount BFBGA footprint with 188 I/O connections.
Unique Advantages
- High logic density: 220,000 logic elements enable integration of large, multi-function designs into a single FPGA package, reducing board-level complexity.
- Substantial on-chip RAM: 13,752,320 total RAM bits provide local storage for buffering, lookup tables, and stateful processing without external memory dependence.
- Compact, production-ready package: 484-BFBGA (484-UBGA, 19×19) and surface-mount assembly support high-density PCB layouts and modern manufacturing flows.
- Documented configuration and I/O timing: Comprehensive datasheet coverage of configuration schemes and I/O timing assists in reliable system bring-up and validation.
- Environmental compliance: RoHS-compliant construction supports regulatory and sustainability requirements for many production programs.
Why Choose 10CX220YU484E6G?
The 10CX220YU484E6G Cyclone® 10 GX FPGA combines a large logic element count with substantial on-chip RAM and a high pin-count package to address complex embedded and system-level designs. Its Extended grade and documented electrical, switching, and configuration specifications make it suitable for designers who need a scalable, well-documented FPGA resource for integration into compact boards.
This device is well suited to development teams and procurement groups targeting applications that demand significant programmable logic and local memory within a surface-mount 484-BFBGA footprint, while relying on datasheet-backed configuration and timing guidance during product development.
Request a quote or submit an inquiry for pricing and availability to begin evaluating the 10CX220YU484E6G for your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018