10CX220YF780I5G
| Part Description |
Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 284 13752320 220000 780-BBGA, FCBGA |
|---|---|
| Quantity | 454 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 284 | Voltage | 900 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80330 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.31.0001 | ||
| Qualification | N/A | Total RAM Bits | 13752320 |
Overview of 10CX220YF780I5G – Cyclone® 10 GX FPGA, 220000 logic elements, 13,752,320 bits RAM, 284 I/O, 780-BBGA
The 10CX220YF780I5G is an Intel Cyclone® 10 GX field programmable gate array (FPGA) provided in a 780-BBGA (FCBGA) package. This industrial-grade device (I5 speed grade) delivers a high density of programmable logic, substantial on-chip RAM, and a large I/O complement for demanding embedded and industrial designs.
Designed for systems that require dense logic, embedded memory, and robust operating range, the device is targeted at industrial applications where temperature tolerance and board-level integration are important design drivers.
Key Features
- Programmable Logic Capacity 220,000 logic elements for implementing complex custom logic, state machines, and data-path functions.
- On-chip Memory 13,752,320 total RAM bits to support large buffers, packet processing, and on-chip data storage.
- I/O Resources 284 I/O pins to interface with multiple peripherals, sensors, and external memory devices.
- Industrial Grade and Speed Industrial (-I5) grade device offering specifications and speed grade intended for industrial application deployment.
- Package and Mounting 780-BBGA, FCBGA package (supplier device package: 780-FBGA, FC (29×29)); surface-mount mounting type for compact board integration.
- Power Supply Core voltage supply specified at 900 mV.
- Operating Temperature Range Rated for −40 °C to 100 °C to meet extended environmental conditions.
- Regulatory RoHS compliant for lead-free manufacturing and global production requirements.
Typical Applications
- Industrial Control and Automation Implement real-time control logic, custom motor-control IP, and deterministic sequencing using the device’s large logic and memory resources within an industrial temperature envelope.
- Embedded System Acceleration Use the high logic count and substantial on-chip RAM to offload compute-intensive tasks and accelerate data-path processing in embedded systems.
- Prototyping and System Integration Rapidly prototype complex interfaces and consolidate multiple peripheral functions using abundant I/O and programmable fabric.
- Sensor and Instrumentation Interfaces Aggregate and preprocess multi-channel sensor data with on-chip RAM buffering and flexible I/O for diverse sensor types.
Unique Advantages
- High-density programmable fabric: 220,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system BOM and board complexity.
- Large on-chip RAM: 13,752,320 total RAM bits support sizable data buffering and local memory for low-latency processing.
- Extensive I/O count: 284 I/O pins provide flexibility for connecting numerous peripherals, interfaces, and external devices without multiplexing compromises.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsher environments common to industrial applications.
- Compact, surface-mount package: 780-BBGA FCBGA footprint supports high-density board designs while maintaining manufacturability.
- RoHS compliant: Meets lead-free manufacturing requirements for global production and assembly.
Why Choose 10CX220YF780I5G?
The 10CX220YF780I5G positions itself as a high-density Cyclone 10 GX FPGA option for industrial designs that require substantial programmable logic, on-chip memory, and a large number of I/Os in a compact surface-mount package. Its industrial (-I5) grading and broad operating temperature range make it suitable for embedded systems and industrial control applications that demand reliable operation across extended environmental conditions.
For teams looking to consolidate functionality, accelerate embedded tasks, or prototype complex interfaces with a single programmable device, this part provides the core resources—logic elements, RAM bits, I/O, and a manufacturable package—to support scalable, production-ready designs.
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