10CX220YF672I6G

The 10CX220YF672I6G is an Intel Cyclone® 10 GX Field Programmable Gate Array (FPGA) supplied in a 672‑ball FBGA (FCBGA) package. It delivers large on‑chip logic and memory resources with 220,000 logic elements and 13,752,320 bits of total RAM, combined with 236 I/O pins for system interfacing.

Designed and graded for industrial use, this surface‑mount FPGA targets designs that require dense programmable logic, significant embedded RAM, and a compact 27 × 27 mm package footprint while operating across an extended temperature range.

Key Features

• Logic Capacity — 220,000 logic elements (cells) to implement large-scale programmable logic and custom datapaths.
• On‑Chip Memory — 13,752,320 total RAM bits for deep buffering, large FIFOs, and embedded storage without external memory.
• I/O Integration — 236 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package and Mounting — 672‑BBGA (FCBGA) surface mount package; supplier device package listed as 672‑FBGA, FC (27×27 mm) for compact board integration.
• Industrial Grade — Device grade specified as Industrial with an operating temperature range of −40 °C to 100 °C.
• Core Supply — Voltage supply specified at 900 mV.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control — Programmable logic and abundant I/O suit motor control, PLC front‑ends, and factory automation modules that require industrial temperature operation.
• High‑Density Logic Integration — Large logic element count and extensive on‑chip RAM support custom acceleration blocks, protocol aggregation, and complex state machines.
• Board‑Level System Integration — 672‑ball FCBGA footprint and 236 I/Os enable compact, high‑pin‑count board designs where space and I/O density are critical.

Unique Advantages

• High Logic and Memory Density: 220,000 logic elements and over 13.7 Mbits of on‑chip RAM concentrate logic and storage into a single device, reducing external component count.
• Industrial Temperature Range: Rated from −40 °C to 100 °C, enabling deployment in harsh or temperature‑variable environments.
• Compact, High‑Pin Package: 672‑FBGA (27×27 mm) package delivers high I/O without a large PCB footprint.
• Single‑Point Core Supply: 900 mV core supply simplifies power‑rail planning for the FPGA core.
• RoHS Compliant: Meets environmental and regulatory requirements for lead‑free assembly.

Why Choose 10CX220YF672I6G?

The 10CX220YF672I6G combines large programmable logic capacity, substantial embedded RAM, and a high I/O count in a compact FCBGA package designed for industrial environments. It is positioned for designs that need concentrated logic resources and memory on a single device while maintaining board‑space efficiency and extended temperature operation.

This device suits engineering teams building robust, scalable systems that require significant on‑chip resources and industrial grading, offering a clear path to consolidate functionality and reduce external BOM complexity.

Request a quote or submit an RFQ to get pricing and availability for the 10CX220YF672I6G.