10CX220YF672E5G

The 10CX220YF672E5G is an Intel Cyclone® 10 GX field programmable gate array supplied in a 672-ball FCBGA package. This extended-grade (-E5) device provides 220,000 logic elements, 13,752,320 total RAM bits and 236 general-purpose I/O, making it suitable for designs that require large on‑chip logic and memory capacity.

Packaging and electrical characteristics are optimized for board-level integration: the device is surface-mount in a 672-FBGA (27×27) footprint and uses a 900 mV core supply. Operating range is specified from 0 °C to 100 °C, and the part is RoHS compliant. The Intel Cyclone 10 GX device datasheet includes detailed electrical, switching and configuration specifications.

Key Features

• Core Logic  220,000 logic elements (cells) provide substantial programmable logic capacity for complex digital designs.
• On‑Chip Memory  13,752,320 total RAM bits available for buffering, packet processing tables, and state storage without external memory.
• I/O Count  236 I/O pins to support a broad set of external interfaces and system connectivity needs.
• Package & Mounting  672-ball BGA (FCBGA) in a 27×27 mm supplier package; surface-mount mounting simplifies automated assembly.
• Grade & Speed  Extended grade, identified with the -E5 speed designation as referenced in the Cyclone 10 GX documentation.
• Power  Core voltage specified at 900 mV for power-domain planning and supply design.
• Operating Temperature  Rated for operation from 0 °C to 100 °C to match typical commercial/embedded thermal environments.
• Standards & Documentation  RoHS compliant; comprehensive device datasheet available describing electrical characteristics, switching characteristics, configuration specifications and I/O timing.

Unique Advantages

• Large programmable fabric: 220,000 logic elements allow integration of complex state machines, datapaths, and control logic on a single device, reducing external component count.
• Substantial on‑chip RAM: Over 13.7 million bits of RAM help minimize external memory requirements for buffering and lookup tables.
• High I/O density: 236 I/O pins provide flexibility for interfacing multiple peripherals, sensors, or transceivers without immediate need for I/O expanders.
• Compact BGA footprint: 672-FBGA (27×27) enables high-density board designs while supporting surface-mount assembly workflows.
• Extended-grade speed option: The -E5 designation provides the extended-grade speed profile referenced in the device documentation for designs targeting that grade.
• Regulatory and design support: RoHS compliance and a detailed datasheet covering electrical, switching and configuration specifications aid regulatory and engineering evaluation.

Why Choose 10CX220YF672E5G?

The 10CX220YF672E5G positions itself as a high-density Cyclone® 10 GX FPGA option for designs that require extensive logic resources, significant on‑chip RAM, and a large I/O complement in a compact BGA package. Its extended-grade (-E5) classification and published datasheet information support engineering evaluation and system integration.

This part is suited to embedded and board-level designs where consolidating logic, memory and I/O into a single programmable device can reduce bill-of-materials complexity and simplify system routing. The combination of documented electrical and configuration specifications, RoHS compliance, and the specified mechanical and thermal data supports confident selection for qualifying projects.

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