10CX220YF672I5G

IC FPGA 236 I/O 672FBGA
Part Description

Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 236 13752320 220000 672-BBGA, FCBGA

Quantity 1,642 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA, FC (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O236Voltage900 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCN3A991DHTS Code8542.31.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10CX220YF672I5G – Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 236 13752320 220000 672-BBGA, FCBGA

The 10CX220YF672I5G is an Intel Cyclone® 10 GX FPGA packaged in a 672‑BBGA (672‑FBGA, FC 27×27) surface‑mount package and offered in an industrial grade. It provides a high‑density programmable fabric with substantial on‑chip RAM and a broad I/O complement for reprogrammable logic applications in demanding temperature environments.

Designed for industrial and embedded systems, this device targets applications that require large logic capacity, significant embedded memory, and a compact BGA footprint while operating across an extended temperature range.

Key Features

  • Logic Capacity  Contains 220,000 logic elements to implement complex custom logic and control functions.
  • Logic Fabric Scale  Provides 80,330 CLB units for structured logic mapping and design partitioning.
  • On‑Chip Memory  Includes 13,752,320 total RAM bits for buffering, packet storage, or state retention without external memory.
  • I/O Count  236 user I/Os delivered from the 672‑FBGA package for wide peripheral and interface connectivity.
  • Power Supply  Core supply specified at 0.9 V (900 mV) to match system power rails and device requirements.
  • Package & Mounting  672‑BBGA / 672‑FBGA (27×27) surface‑mount package for high‑density board integration.
  • Industrial Grade & Temperature Range  Industrial grade device rated for operation from −40 °C to 100 °C for extended environmental tolerance.
  • Standards Compliance  RoHS compliant to support restricted‑substance requirements.
  • Documentation Coverage  Datasheet coverage for electrical characteristics, configuration timing, I/O timing, and transceiver performance for Cyclone 10 GX devices is available.

Typical Applications

  • Industrial Control Systems  Use the device’s industrial grade and −40 °C to 100 °C operating range for control, monitoring and automation logic in harsh environments.
  • High‑Density Logic Integration  Deploy the 220,000 logic elements and on‑chip RAM for complex protocol processing, custom datapaths, or control plane functions.
  • Networking & Data Movement  Leverage the Cyclone 10 GX family’s documented transceiver and I/O characteristics to implement packet buffering, bridging, or interface adaptation.

Unique Advantages

  • Substantial Logic Resources:  220,000 logic elements enable large, integrated designs that reduce the need for multiple discrete logic devices.
  • Generous On‑Chip RAM:  13.75 Mb of embedded RAM supports local buffering and state storage, minimizing external memory dependencies.
  • Broad I/O in a Compact Package:  236 I/Os in a 672‑FBGA (27×27) package facilitate dense system integration while preserving board area.
  • Industrial Reliability:  Industrial grade construction and a −40 °C to 100 °C rating enable deployment across a wide range of operating conditions.
  • Single Core Voltage:  0.9 V core supply simplifies power rail planning for systems using standard low‑voltage domains.
  • Regulatory Compliance:  RoHS compliance supports restricted‑substance requirements for manufacturing and procurement.

Why Choose 10CX220YF672I5G?

The 10CX220YF672I5G delivers a combination of high logic density, significant embedded RAM, and a substantial I/O count in a compact 672‑FBGA surface‑mount package. Its industrial grade rating and −40 °C to 100 °C operating range make it suitable for designs that must run reliably in challenging environments.

This Cyclone® 10 GX family device is appropriate for engineering teams seeking scalable programmable logic capacity documented by Intel’s Cyclone 10 GX device datasheet, enabling confident integration into industrial and embedded systems that require on‑board memory, flexible I/O, and a single 0.9 V core power domain.

Request a quote or submit a procurement inquiry to learn more about lead times, pricing, and availability for the 10CX220YF672I5G.

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