10CX220YF780E6G

The 10CX220YF780E6G is an Intel Cyclone® 10 GX field programmable gate array (FPGA) in an extended grade offering. It provides a high-density programmable-logic fabric with substantial embedded RAM and a broad I/O count, packaged in a 780‑ball BGA for surface-mount applications.

This device is intended for designs that require up to 220,000 logic elements, more than 13.75 Mbits of embedded RAM, and up to 284 I/Os while operating from a 0.9 V core supply and an extended operating-temperature window.

Key Features

• Core Density  220,000 logic elements for complex custom logic and large-scale programmable designs.
• Embedded Memory  13,752,320 total RAM bits to support on-chip buffering, lookup tables, and data storage.
• I/O Count  Up to 284 user I/Os to connect a wide variety of external devices and interfaces.
• Package & Mounting  780‑BBGA (FCBGA) surface-mount package; supplier device package listed as 780‑FBGA (29×29).
• Power Supply  Core supply specified at 0.900 V (900 mV).
• Operating Range  Rated for operation from 0 °C to 100 °C (extended grade).
• Grade  Extended grade (–E6 speed grade availability is defined for Cyclone 10 GX extended devices).
• Regulatory  RoHS compliant.

Typical Applications

• High-density logic implementations  Custom hardware acceleration and complex finite-state machines that benefit from up to 220,000 logic elements and large on-chip RAM.
• IO‑intensive systems  Platforms requiring many external connections: the 284 I/Os enable flexible interfacing for sensors, peripherals, and board-level routing.
• Embedded compute and buffering  On-chip memory (13,752,320 bits) supports data buffering, packet handling, and intermediate storage within FPGA logic.
• Prototyping and production boards  Surface-mount 780‑BBGA packaging fits compact, high-density PCB layouts for evaluation and volume designs.

Unique Advantages

• High logic capacity: 220,000 logic elements provide the headroom to implement large, integrated functions on a single device, reducing external glue logic.
• Substantial on‑chip RAM: 13.75 Mbits of embedded RAM enables sizeable internal data storage for buffering and algorithmic state without off‑chip memory.
• Large I/O complement: 284 I/Os simplify board routing and peripheral integration, minimizing the need for external expanders.
• Compact BGA package: 780‑ball FCBGA (29×29) supports dense PCB implementations while maintaining surface-mount manufacturability.
• Extended-grade operation: Rated for 0 °C to 100 °C operation, suitable for applications that require elevated ambient tolerance within the extended grade range.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 10CX220YF780E6G?

The 10CX220YF780E6G combines high programmable-logic density, significant embedded RAM, and a large I/O count in a compact 780‑BBGA surface-mount package. As an extended-grade Cyclone® 10 GX device, it suits designs that need substantial on-chip resources while maintaining a streamlined BOM and PCB footprint.

This device is appropriate for engineers and design teams targeting advanced FPGA implementations that require on-device buffering, extensive I/O connectivity, and a high number of logic elements, all backed by the Cyclone 10 GX device family specifications.

Request a quote or submit an inquiry to obtain pricing and availability for the 10CX220YF780E6G and to discuss lead times and ordering options.