10CX220YF780I6G

The 10CX220YF780I6G is an Intel Cyclone® 10 GX family FPGA offering high-density programmable logic in a 780-ball FCBGA package. It delivers 220,000 logic elements and 13,752,320 total RAM bits in a surface-mount 780-FBGA (29×29) footprint.

Designed for industrial-grade applications, this device provides a 900 mV core supply and an operating temperature range of −40 °C to 100 °C, making it suitable for systems that require significant on-chip logic and memory capacity within a compact BGA package.

Key Features

• High Logic Density  220,000 logic elements for complex programmable logic, custom datapaths, and large FPGA designs.
• On‑Chip Memory  13,752,320 total RAM bits to support buffering, lookup tables, and embedded memory structures.
• Rich I/O  284 device I/Os to interface with multiple peripherals, buses, and external devices.
• Industrial Grade and Temperature Range  Built and specified for industrial operation with an ambient range of −40 °C to 100 °C.
• Package & Mounting  780-ball BGA (FCBGA) surface-mount package; supplier device package listed as 780‑FBGA (29×29) for board-level integration.
• Core Voltage  900 mV core supply as specified for device operation.
• Regulatory Compliance  RoHS-compliant construction for global environmental requirements.

Typical Applications

• Industrial Control  Use where industrial temperature range and high logic capacity are required for control, sequencing, and I/O aggregation.
• High‑Density Embedded Systems  On-chip RAM and large logic element counts support complex embedded functions and custom hardware acceleration.
• Communications and Networking Equipment  Large I/O pin count and memory resources support multi‑lane interfaces and packet buffering in networked systems.
• Data Acquisition and Processing  Ample logic and RAM resources enable real‑time signal handling and preprocessing in measurement and instrumentation platforms.

Unique Advantages

• Significant Logic Resources: 220,000 logic elements provide headroom for large designs and system-on-chip style integration.
• Substantial On‑Chip Memory: Over 13.7 million RAM bits reduce the need for external memory in many buffering and LUT applications.
• Ample I/O Connectivity: 284 I/Os allow flexible interfacing with sensors, transceivers, and external controllers without excessive external glue logic.
• Industrial Reliability: Specified industrial temperature range (−40 °C to 100 °C) supports deployment in harsh and uncontrolled environments.
• Compact BGA Package: The 780‑FBGA (29×29) surface‑mount package balances board space efficiency with high pin count for advanced designs.
• Regulatory Compliance: RoHS compliance facilitates integration into products that require environmental conformity.

Why Choose 10CX220YF780I6G?

The 10CX220YF780I6G positions itself as a high‑density, industrial‑grade Cyclone® 10 GX FPGA suited for designs that need substantial programmable logic, large on‑chip memory, and extensive I/O in a compact BGA footprint. Its specified operating range and RoHS compliance align it with industrial applications where reliability and environmental compliance are important.

Engineers and procurement teams targeting embedded systems, communications hardware, or industrial controls will find the combination of 220,000 logic elements, 13,752,320 RAM bits, and 284 I/Os valuable for consolidating functionality, simplifying board-level design, and scaling designs within the Cyclone 10 GX family.

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