10CX220YF780E5G

The 10CX220YF780E5G is an Intel Cyclone® 10 GX field programmable gate array in a 780-ball FCBGA package. It is an extended-grade (-E5) device that provides a high-density programmable fabric with on-chip memory and a large I/O count for complex digital designs.

This device targets applications that require large logic capacity and substantial embedded RAM while fitting into a compact surface-mount BGA footprint. Key device parameters include 220,000 logic elements, 13,752,320 total RAM bits, 284 I/Os, and operation across a 0 °C to 100 °C temperature range.

Key Features

• Logic Capacity  220,000 logic elements (cells) for implementing complex custom logic and large-scale digital functions.
• Embedded Memory  13,752,320 total RAM bits for on-chip data buffering, state storage, and memory-intensive algorithms.
• I/O Resources  284 user I/Os to support broad peripheral aggregation, parallel interfaces, and flexible board-level connectivity.
• Package & Mounting  780-ball FCBGA package (supplier device package: 780-FBGA, FC (29×29)) with surface-mount mounting for high-density board designs.
• Voltage Supply  Core supply specified at 900 mV (900 mV to 900 mV), matching the device’s internal power requirements.
• Operating Grade & Temperature  Extended grade, -E5 speed option; rated operating temperature 0 °C to 100 °C.
• Standards Compliance  RoHS compliant to support environmentally conscious assembly and regulatory requirements.
• Series Documentation  Device datasheet includes detailed electrical, switching, configuration, and I/O timing specifications for system integration and validation.

Typical Applications

• Custom digital processing  Implement large datapath and control logic using 220,000 logic elements and substantial embedded RAM for acceleration and bespoke algorithms.
• High-pin-count I/O aggregation  Consolidate multiple peripherals and parallel interfaces using 284 I/Os to reduce external glue logic and simplify board routing.
• Compact, high-density systems  Fit high functionality into compact boards with the 780-ball FCBGA surface-mount package while retaining large logic and memory resources.
• Configurable protocol bridging and interfacing  Use the device’s logic and I/O resources to implement protocol translation, custom bus interfaces, and peripheral controllers.

Unique Advantages

• High integration density: 220,000 logic elements combined with 13,752,320 RAM bits reduce the need for external glue logic and memory components.
• Extensive I/O capability: 284 I/Os provide design flexibility for complex board-level signaling and peripheral consolidation.
• Compact BGA footprint: 780-FBGA (29×29) surface-mount package enables high-density PCB layouts while maintaining robust connectivity.
• Extended-grade speed option: Supplied in the -E5 extended speed grade for customers selecting the faster extended-grade device variant.
• Regulatory compliance: RoHS-compliant construction supports environmentally regulated manufacturing processes.

Why Choose 10CX220YF780E5G?

The 10CX220YF780E5G positions itself as a high-density Cyclone® 10 GX FPGA option for designs that require large programmable logic capacity, significant on-chip RAM, and broad I/O capability in a compact BGA package. Its extended-grade -E5 configuration and defined operating range make it suitable for systems requiring deterministic device behavior within 0 °C to 100 °C.

Designers and procurement teams seeking a feature-rich FPGA with clear hardware parameters—logic density, RAM capacity, I/O count, package details, and RoHS compliance—can leverage this device for scalable, integration-forward designs where board area and on-chip resources are key selection criteria.

Request a quote or submit an inquiry to get pricing, availability, and support for 10CX220YF780E5G for your next design cycle.