10CX220YF672E6G

The 10CX220YF672E6G is an Intel Cyclone® 10 GX field-programmable gate array (FPGA) in a 672-ball FCBGA package. It combines a high logic capacity with on-chip RAM and a substantial I/O complement for designs that require programmable logic, embedded memory, and high I/O density.

Built in an extended speed grade (–E6) and supplied in a surface-mount 672-FBGA (27×27) package, this device is targeted at engineers and system designers who need scalable programmable logic and integration in a compact package.

Key Features

• Logic Capacity 220000 logic elements (cells) for implementing large programmable logic designs and custom hardware accelerators.
• On-chip Memory 13,752,320 total RAM bits to support local buffering, FIFOs, and memory-intensive logic functions without external memory.
• I/O Resources 236 I/O pins to interface with sensors, peripherals, high-speed buses, and system interfaces.
• Package 672-BBGA, FCBGA (supplier package: 672-FBGA 27×27) in a surface-mount form factor suitable for compact board designs.
• Power Core supply specified at 900 mV (900 mV to 900 mV range listed) to match system power rails and design constraints.
• Operating Range Extended grade operation from 0 °C to 100 °C, providing a defined ambient range for thermal and system planning.
• RoHS Compliant Compliant with RoHS directives for material and environmental requirements.

Typical Applications

• High-density signal processing Implement custom data-paths and pipeline architectures using 220,000 logic elements paired with 13.7 Mbit on-chip memory for buffering and real-time processing.
• Interface aggregation and bridging Consolidate multiple interfaces or implement protocol translation using 236 available I/Os to connect diverse peripherals and buses.
• Embedded system acceleration Offload compute-intensive tasks to FPGA fabric and local RAM to reduce latency in embedded controllers and data-acquisition systems.

Unique Advantages

• High logic density: 220,000 logic elements enable complex implementations and larger custom hardware blocks without partitioning across multiple devices.
• Substantial on-chip RAM: 13,752,320 RAM bits reduce reliance on external memory for many buffering and state-storage needs, simplifying board-level design.
• Generous I/O count: 236 I/Os provide flexibility for multi-channel interfaces, sensor arrays, and peripheral expansion in space-constrained designs.
• Compact, surface-mount package: 672-FBGA (27×27) offers a dense package profile for systems requiring high integration in a small PCB footprint.
• Extended-grade operation: Specified 0 °C to 100 °C ambient range and extended-grade classification support reliable operation within defined thermal envelopes.
• Vendor-backed documentation: Device specifications and electrical characteristics are defined in the Intel Cyclone 10 GX device datasheet to support design and verification.

Why Choose 10CX220YF672E6G?

The 10CX220YF672E6G positions itself as a high-capacity Cyclone® 10 GX FPGA option that balances large programmable logic resources, significant on-chip RAM, and a high I/O count in a compact 672-ball FCBGA package. Its extended-grade designation and documented operating conditions make it suitable for system designs that require defined ambient operation and robust on-chip resources.

This device is appropriate for engineering teams building complex signal processing, interface consolidation, or embedded acceleration solutions that benefit from integrated RAM, extensive logic fabric, and a high-density I/O footprint backed by Intel device documentation.

If you would like pricing, availability, or to request a quote for the 10CX220YF672E6G, submit a quote request or contact sales to receive detailed commercial information.