10CX220YU484I5G

IC FPGA 188 I/O 484UBGA
Part Description

Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 13752320 220000 484-BFBGA

Quantity 1,565 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BFBGANumber of I/O188Voltage900 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCNEAR99HTS Code8542.31.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10CX220YU484I5G – Cyclone® 10 GX Field Programmable Gate Array (FPGA), 220,000 logic elements, 484-BFBGA

The 10CX220YU484I5G is an Intel Cyclone® 10 GX Field Programmable Gate Array (FPGA) packaged in a 484‑BFBGA (supplier package: 484‑UBGA, 19×19) surface‑mount device. It provides 220,000 logic elements and 13,752,320 bits of on‑chip RAM, along with 188 I/O pins for system integration.

Designed for industrial‑grade operation, this device supports an operating temperature range of −40 °C to 100 °C and is RoHS compliant. The device specifies a supply voltage of 900 mV.

Key Features

  • Core / Architecture Cyclone® 10 GX FPGA family device offering a large logic fabric with 220,000 logic elements to implement complex programmable logic and custom functions.
  • Memory Resources 13,752,320 total on‑chip RAM bits to support buffering, FIFOs, and embedded data storage.
  • I/O Capacity 188 general‑purpose I/O pins to interface with peripheral devices and system buses.
  • Package & Mounting 484‑BFBGA package (supplier device package: 484‑UBGA, 19×19) supplied as a surface‑mount component for compact PCB integration.
  • Power Voltage supply specified at 900 mV.
  • Temperature & Grade Industrial temperature rating from −40 °C to 100 °C for deployment in thermally demanding environments.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic capacity: 220,000 logic elements enable implementation of sizeable custom logic, offloading tasks from host processors.
  • Substantial on‑chip memory: 13.7 million bits of RAM reduce the need for external memory in many buffering and data‑processing roles.
  • Ample I/O count: 188 I/Os provide flexibility for multi‑lane interfaces, parallel buses, and mixed signal front‑ends.
  • Industrial temperature range: Rated from −40 °C to 100 °C to support deployment in temperature‑sensitive industrial systems.
  • Compact BGA integration: 484‑BFBGA (484‑UBGA, 19×19) surface‑mount package supports dense PCB layouts and commercial assembly workflows.
  • Regulatory readiness: RoHS compliance assists in meeting environmental requirements for modern electronics manufacturing.

Why Choose 10CX220YU484I5G?

The 10CX220YU484I5G combines a high logic element count, substantial on‑chip RAM, and a generous I/O complement within an industrial‑rated, RoHS‑compliant BGA package. As a member of the Cyclone® 10 GX family from Intel, it is suitable for designs that require programmable logic capacity and robust thermal performance.

This device is appropriate for development teams and procurement professionals seeking a field‑programmable solution with clear, verifiable resource specifications—logic elements, RAM bits, I/O count, package type, supply voltage, and operating temperature—that can be integrated into industrial applications.

Request a quote or submit a quote for the 10CX220YU484I5G to review pricing and availability for your next design.

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