10CX150YU484E5G

The 10CX150YU484E5G is an Intel Cyclone® 10 GX Field Programmable Gate Array (FPGA) supplied in a 484‑ball BFBGA package. This Extended‑grade device provides up to 150,000 logic elements, approximately 10,907,648 bits of on‑chip RAM, and 188 I/O pins for high‑density programmable designs.

Packaged as a 484‑UBGA (19×19) surface‑mount device and specified for 0 °C to 100 °C operation, this FPGA is targeted at applications that require substantial logic capacity, embedded RAM, and a moderate count of configurable I/O in a compact BFBGA footprint.

Key Features

• Logic Capacity — 150,000 logic elements to implement complex digital functions and large programmable logic blocks.
• Embedded Memory — 10,907,648 total RAM bits for on‑chip buffering, FIFOs, and local data storage.
• Configurable I/O — 188 I/O pins to support multiple external interfaces and parallel/serial connectivity needs.
• Package and Mounting — 484‑BFBGA package (supplier package 484‑UBGA, 19×19) optimized for surface‑mount assembly in space‑constrained PCBs.
• Grade and Temperature — Extended grade device rated for operation from 0 °C to 100 °C.
• Power Supply — Core voltage supply specified at 900 mV.
• Standards Compliance — RoHS compliant.

Typical Applications

• High‑density programmable logic — Implement complex state machines, datapaths, and custom logic functions using the device’s large logic element count.
• Embedded memory buffering — Use the 10.9Mbit on‑chip RAM for local data storage, packet buffering, or intermediate processing.
• Interface aggregation — 188 I/O pins allow aggregation and bridging of multiple external interfaces in a single FPGA package.

Unique Advantages

• Substantial logic integration: 150,000 logic elements enable dense implementation of programmable logic without external gate arrays.
• Large on‑chip RAM: Over 10.9 Mbits of embedded RAM reduces reliance on off‑chip memory for intermediate data storage.
• Compact BFBGA package: 484‑ball BFBGA (484‑UBGA, 19×19) balances high pin count with a small board footprint for space‑constrained designs.
• Extended temperature rating: Specified for 0 °C to 100 °C operation to meet a wide range of commercial and industrial environmental envelopes.
• Surface‑mount ready: Delivered in a surface‑mount package for standard PCB assembly flows.
• Regulatory compliance: RoHS compliance supports modern PCB manufacturing and environmental requirements.

Why Choose 10CX150YU484E5G?

The 10CX150YU484E5G delivers a balance of high logic density, significant on‑chip memory, and a high I/O count in a compact 484‑BFBGA package. As an Extended‑grade Cyclone® 10 GX device, it is suitable for designers who need substantial programmable resources and embedded RAM within a surface‑mount BGA footprint while maintaining standard commercial temperature operation.

This part is well suited to engineering teams building designs that require integrated logic and memory capacity with flexible I/O allocation and compact packaging, offering a solution that simplifies board-level integration and reduces the need for external memory in many designs.

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