10CX150YF780I6G

The 10CX150YF780I6G is an Intel Cyclone 10 GX field programmable gate array (FPGA) packaged in a 780‑ball FCBGA (29×29) offering 284 I/O. This industrial‑grade device provides 150,000 logic elements and 10,907,648 total RAM bits in a single, surface‑mount FPGA.

Designed for systems that require high-density programmable logic and on‑chip memory within industrial operating conditions, the device combines a compact 780‑BBGA package, a 0.9 V core supply, and an extended operating range of −40 °C to 100 °C.

Key Features

• Logic Capacity — 150,000 logic elements to implement complex programmable logic and custom datapaths.
• Core Architecture — Cyclone® 10 GX family device as documented in the Intel Cyclone 10 GX device datasheet, including configuration and power management sections.
• On‑chip Memory — 10,907,648 total RAM bits to support large buffers, tables, and local memory structures.
• I/O Resources — 284 available I/O pins suitable for a wide range of peripheral and system interconnects.
• Package and Mounting — 780‑BBGA (FBGA 29×29) surface‑mount package for high‑density board integration.
• Power — Core voltage supply specified at 900 mV (900 mV to 900 mV), enabling defined core power planning.
• Industrial Grade and Temperature Range — Rated industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Configuration and System Features — Device family documentation includes configuration specifications and timing (JTAG, FPP, AS, PS schemes), POR, initialization, and remote system upgrade considerations.

Typical Applications

• Industrial Control and Automation — Industrial‑grade temperature range (−40 °C to 100 °C) and significant logic/memory resources make the device suitable for factory and process control systems.
• Communications and Interface Bridging — High logic density and abundant I/O allow implementation of protocol bridging and custom interface logic.
• Remote System Upgrades — The datasheet for the Cyclone 10 GX family describes remote system upgrade capabilities, enabling maintainable field‑upgradeable designs.

Unique Advantages

• High Logic Density: 150,000 logic elements provide capacity for complex algorithms and parallel datapaths without external logic.
• Large On‑Chip RAM: Over 10.9 million RAM bits to support deep buffering, lookup tables, and state storage directly on the FPGA fabric.
• Industrial Reliability: Industrial grade rating and wide operating temperature range support deployment in temperature‑challenging environments.
• Compact, High‑Pin Package: 780‑BBGA FCBGA (29×29) offers a high I/O count in a compact surface‑mount footprint for dense board designs.
• Defined Core Power: 0.9 V core supply allows precise power budgeting for FPGA‑centric systems.
• Documented Configuration Options: Family datasheet includes configuration timing and multiple configuration schemes to support diverse system architectures.

Why Choose 10CX150YF780I6G?

The 10CX150YF780I6G balances substantial programmable logic and on‑chip memory with a compact 780‑ball FCBGA package and industrial operating range. Its 150,000 logic elements, 10,907,648 RAM bits, and 284 I/O make it suitable for embedded systems and industrial designs that require significant local processing and flexible I/O connectivity.

Backed by Cyclone 10 GX family documentation covering electrical characteristics, configuration schemes, and system initialization, this device is positioned for engineers who need verifiable specifications for integration, power planning, and field upgradeability in industrial environments.

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