10CX150YF672I6G

The 10CX150YF672I6G is an Intel Cyclone® 10 GX FPGA device supplied in a 672-ball FCBGA package. It delivers large programmable logic capacity with on-chip memory and rich I/O to support complex, industrial-grade designs.

This device is specified for industrial operation and includes configuration and performance details in the Cyclone 10 GX device documentation, making it suitable for designs that require a scalable logic fabric, substantial RAM, and a fixed 0.9 V core supply.

Key Features

• Logic Capacity  150,000 logic elements provide a sizable programmable fabric for implementing complex digital functions and custom processing pipelines.
• On‑chip Memory  10,907,648 total RAM bits enable buffering, packet processing, and intermediate storage for data‑heavy designs.
• I/O Resources  236 I/O pins support broad connectivity to external peripherals, sensors, and high‑speed interface PHYs.
• Industrial Grade  Device is specified as industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Power  Specified core supply at 0.900 V provides deterministic supply requirements for power budgeting and system-level design.
• Package & Mounting  672‑FBGA (27 × 27) FCBGA package for high‑density board integration; surface mount mounting type for standard PCB assembly.
• Documented Configuration & Performance  Datasheet content for the Cyclone 10 GX family covers electrical characteristics, configuration timing, transceiver and I/O performance, and other implementation details.
• RoHS Compliant  Device is RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• Industrial Control  Use the device’s industrial temperature rating and extensive I/O to implement motor control, PLC interfaces, and factory automation logic.
• High‑density Logic and Processing  Leverage 150,000 logic elements and >10 Mb of on‑chip RAM for data path acceleration, protocol processing, and custom compute blocks.
• Multi‑I/O Interface Designs  236 I/O pins allow flexible interfacing to sensors, ADC/DAC subsystems, and external memory or transceiver PHYs.
• Field‑Upgradable Systems  Configuration and remote upgrade capabilities described in the Cyclone 10 GX documentation support maintainable, updatable FPGA-based products.

Unique Advantages

• Substantial Logic Density: 150,000 logic elements enable integration of large custom logic functions and multiple concurrent accelerators on a single device.
• Large On‑chip RAM: 10,907,648 bits of RAM reduce dependence on external memory for buffering and intermediate storage, simplifying PCB design and lowering system latency.
• Robust Industrial Specification: Rated for −40 °C to 100 °C operation to meet environmental demands common in industrial deployments.
• Deterministic Core Supply: Fixed 0.900 V core requirement simplifies power-supply design and system-level power budgeting.
• High‑density Package: 672‑FBGA (27 × 27) FCBGA offers compact, manufacturable integration for space-constrained designs.
• Complete Documentation: Cyclone 10 GX device documentation includes electrical, configuration, and I/O timing specifications to support reliable implementation and validation.

Why Choose 10CX150YF672I6G?

The 10CX150YF672I6G is positioned for designers who need a combination of large programmable logic capacity, significant on‑chip RAM, and broad I/O in an industrial‑rated FPGA. Its 672‑FBGA footprint and surface‑mount mounting support compact, manufacturable board layouts while the documented configuration and performance data enable predictable system integration.

This device is suited to engineering teams building industrial automation, data‑processing, and multi‑interface systems that require scalable logic, embedded memory resources, and a device qualified for extended temperature operation.

Request a quote or submit a procurement inquiry to get pricing and availability for the 10CX150YF672I6G.