10CX150YF672E5G

The 10CX150YF672E5G is an Intel Cyclone® 10 GX field-programmable gate array (FPGA) in a 672‑ball BGA (FCBGA) package. It delivers a high logic-density FPGA fabric with substantial on‑chip RAM and a broad set of I/O for compact, surface‑mount designs.

Designed as an extended‑grade Cyclone 10 GX device, this part targets applications that require a combination of logic capacity, embedded memory, and a compact 672‑FBGA (27×27 mm) footprint while operating within a 0 °C to 100 °C temperature range.

Key Features

• Core logic — 150,000 logic elements to implement complex FPGA designs and custom digital functions.
• On‑chip memory — 10,907,648 total RAM bits for buffering, packet storage, and intermediate data processing.
• I/O capacity — 236 user I/O pins to support wide interfacing requirements and external device connectivity.
• Package & mounting — 672‑BBGA, FCBGA package (supplier package: 672‑FBGA, FC, 27×27 mm) for surface‑mount PCB integration.
• Grade & temperature — Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Voltage supply — Specified supply voltage at 900 mV.
• Configuration options — Datasheet references standard FPGA configuration schemes and timings (JTAG, FPP, AS, PS), enabling platform configuration and updates per Cyclone 10 GX documentation.
• Compliance — RoHS‑compliant component.

Typical Applications

• High‑density digital processing — Implement algorithm acceleration, data path logic, and custom processing blocks using 150,000 logic elements and on‑chip RAM.
• Interface aggregation — Aggregate and manage multiple peripherals or buses with 236 I/O pins for flexible external connectivity.
• Embedded system control — Use the FPGA fabric and embedded RAM for control logic, sequencing, and local data buffering within constrained PCB area thanks to the 672‑BBGA package.
• Configurable hardware prototyping — Evaluate and iterate hardware designs on a high‑logic‑density Cyclone 10 GX device with documented configuration schemes.

Unique Advantages

• High logic capacity: 150,000 logic elements provide the raw resources to implement sizable FPGA designs without external logic.
• Significant on‑chip RAM: 10,907,648 bits of RAM reduce dependence on external memory for many buffering and state‑storage needs.
• Ample I/O: 236 user I/Os enable versatile interfacing to sensors, peripherals, and external devices.
• Compact package: 672‑FBGA (27×27 mm) form factor allows integration into space‑constrained PCBs while keeping the device surface‑mount compatible.
• Extended grade operation: Rated as an extended grade device and specified to operate across 0 °C to 100 °C for a wide range of commercial embedded environments.
• Standards‑based configuration: Supported configuration schemes documented in the Cyclone 10 GX datasheet simplify system bring‑up and remote updates.

Why Choose 10CX150YF672E5G?

The 10CX150YF672E5G combines 150,000 logic elements, over 10.9 million bits of on‑chip RAM, and 236 I/Os in a compact 672‑BBGA package to deliver a balanced solution for designs that need substantial programmable logic and embedded memory in a small footprint. Its extended grade rating and documented configuration options make it suitable for commercial embedded systems that require reliable operation within a 0 °C to 100 °C range.

This Intel Cyclone 10 GX FPGA is appropriate for engineers and procurement teams seeking a high‑capacity, RoHS‑compliant FPGA in a surface‑mount 672‑FBGA form factor (27×27 mm) with clearly defined electrical and configuration characteristics per the Cyclone 10 GX documentation.

Request a quote or submit an RFQ referencing part number 10CX150YF672E5G to obtain pricing and availability for your design and procurement planning.