10CX105YU484E5G

IC FPGA 188 I/O 484UBGA
Part Description

Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 8641536 104000 484-BFBGA

Quantity 991 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeExtendedOperating Temperature0°C – 100°C
Package / Case484-BFBGANumber of I/O188Voltage900 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38000Number of Logic Elements/Cells104000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8641536

Overview of 10CX105YU484E5G – Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 8641536 104000 484-BFBGA

The 10CX105YU484E5G is an Intel Cyclone® 10 GX field-programmable gate array (FPGA) supplied in a 484-ball BFBGA package. It delivers a balance of programmable logic, on-chip RAM, and I/O capacity for system designs that require substantial logic resources in a compact surface-mount package.

Key device characteristics include 104,000 logic elements, 8,641,536 total RAM bits, 188 user I/O, extended-grade qualification, a 900 mV core supply, and an operating temperature range of 0°C to 100°C—attributes that support dense digital integration and system-level consolidation.

Key Features

  • Programmable Logic Capacity  104,000 logic elements provide a significant resource pool for implementing complex digital functions and custom hardware acceleration.
  • On‑Chip Memory  Total RAM of 8,641,536 bits enables substantial buffering, FIFOs, and embedded data storage for signal processing and protocol handling.
  • Rich I/O Count  188 user I/O pins support a wide range of external interfaces and signaling requirements from a single device.
  • Package and Mounting  484-BFBGA (supplier package: 484-UBGA, 19×19) in a surface-mount form factor for high-density PCB designs.
  • Power  Core supply specified at 900 mV for device operation.
  • Extended Grade and Thermal Range  Extended-grade device with an operating temperature range of 0°C to 100°C for reliable operation in commercial-to-industrial thermal environments.

Unique Advantages

  • High logic density: 104,000 logic elements provide headroom for complex algorithms, datapaths, and custom IP integration without external logic.
  • Large on‑chip RAM: 8.64 Mb of RAM reduces the need for external memory for many buffering and processing tasks, simplifying board-level design.
  • Ample I/O resources: 188 user I/O pins enable direct interfacing to multiple peripherals and high‑pin-count systems from a single FPGA.
  • Compact BFBGA packaging: 484-ball 19×19 UBGA package supports dense PCB routing while maintaining surface-mount compatibility.
  • Defined power and thermal specs: 900 mV core supply and 0°C to 100°C operating range make system-level power budgeting and thermal planning straightforward.
  • Manufacturer pedigree: Designed and manufactured by Intel, with comprehensive device documentation and datasheet-level electrical and configuration details.

Why Choose 10CX105YU484E5G?

This Intel Cyclone® 10 GX FPGA is positioned for designs that need a substantial mix of logic, embedded RAM, and I/O in a single, surface-mount BFBGA package. The device’s 104,000 logic elements and 8,641,536 bits of on-chip RAM make it suitable for consolidating multiple functions into a single programmable device, while 188 I/O pins support diverse board-level connectivity.

With an extended-grade device designation, a 900 mV core supply, and a defined 0°C to 100°C operating range, the 10CX105YU484E5G offers predictable electrical and thermal behavior for production designs sourced from a major FPGA manufacturer.

Request a quote or submit an inquiry to receive pricing and availability for 10CX105YU484E5G and to discuss how this Cyclone® 10 GX FPGA can fit into your next design.

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