10CX105YF780I6G

The 10CX105YF780I6G is an Intel Cyclone® 10 GX FPGA configured for industrial-grade applications. It provides a high-density programmable fabric with 104,000 logic elements and 8,641,536 bits of on-chip RAM, packaged in a 780-ball FCBGA/FBGA footprint.

Designed for embedded and industrial designs that require significant logic capacity and I/O count, this device targets implementations where on-chip memory, large I/O count, and industrial operating range are required.

Key Features

• Core Logic — 104,000 logic elements provide the programmable logic capacity for complex custom functions and parallel processing.
• Memory — 8,641,536 total RAM bits enable substantial on-chip buffering, FIFOs, and memory-accelerated algorithms.
• I/O Count — 284 user I/Os to support wide peripheral interfacing, bus bridging, and parallel I/O requirements.
• Package — 780-ball BGA / FCBGA (supplier package: 780-FBGA 29×29) for high-density board integration in space-constrained systems.
• Voltage — Core voltage specified at 900 mV, consistent with low-voltage FPGA core operation.
• Temperature Range — Industrial operating range from −40 °C to 100 °C for reliable operation in harsh environments.
• Industrial Grade — Device is specified as Industrial grade to meet higher temperature and reliability requirements common in industrial systems.
• Regulatory — RoHS compliant to meet environmental substance restrictions.

Typical Applications

• Industrial Automation — Implement control logic, local data buffering, and I/O aggregation using the device’s industrial grade rating, large logic capacity, and substantial on-chip RAM.
• High‑Density I/O Systems — Deploy the 284 I/Os for parallel sensor arrays, GPIO hubs, or protocol bridging where many signals must be handled simultaneously.
• Embedded Processing and Acceleration — Use the 104,000 logic elements and 8,641,536 RAM bits to offload deterministic, latency-sensitive tasks from host processors.

Unique Advantages

• Significant Logic Capacity: 104,000 logic elements allow integration of complex state machines, pipelines, and parallel datapaths on a single device.
• Large On‑Chip Memory: 8.64 Mb of RAM bits supports deep buffering and local data storage, reducing external memory dependency and simplifying board design.
• High I/O Count: 284 user I/Os provide flexibility to connect numerous peripherals, sensors, and buses without additional I/O expanders.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployments in demanding thermal environments.
• Compact, High‑Density Package: 780-ball FCBGA/FBGA (29×29) enables a compact board footprint while maintaining routing density for complex systems.
• Compliance and Supply Chain Friendly: RoHS compliance supports regulatory and manufacturing requirements for many commercial and industrial products.

Why Choose 10CX105YF780I6G?

The 10CX105YF780I6G balances high programmable logic density, substantial on-chip RAM, and a large I/O complement in an industrial-grade FPGA package. Its specification set makes it suitable for engineers who need to consolidate complex logic, memory buffering, and extensive interfacing into a single programmable device while maintaining operation across a wide temperature range.

This part is well suited for teams building industrial controllers, high‑I/O embedded systems, and hardware-accelerated functions where on-chip resources and reliability are primary considerations. The combination of logic capacity, RAM, and I/O helps reduce external components and simplifies system integration.

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