10CX105YF780E6G
| Part Description |
Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 284 8641536 104000 780-BBGA, FCBGA |
|---|---|
| Quantity | 969 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 284 | Voltage | 900 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38000 | Number of Logic Elements/Cells | 104000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 8641536 |
Overview of 10CX105YF780E6G – Cyclone® 10 GX Field Programmable Gate Array (FPGA), 104000 logic elements, 8,641,536 bits RAM, 284 I/Os, 780-BBGA
The 10CX105YF780E6G is a Cyclone® 10 GX family FPGA in an extended grade offering. It provides a programmable logic fabric with 104,000 logic elements and 8,641,536 bits of on-chip RAM for implementing complex digital functions and buffering within system designs.
This device is supplied in a 780-ball fine-pitch BGA (780-BBGA / 780-FBGA, FC 29×29) surface-mount package, supports a core supply of 0.9 V, and operates over a 0 °C to 100 °C range. Documentation for the Cyclone 10 GX family includes detailed electrical, configuration, and I/O timing specifications.
Key Features
- Logic Capacity 104,000 logic elements to implement sizable combinational and sequential logic networks.
- On-Chip Memory 8,641,536 bits of total RAM for data buffering, FIFOs, and local storage.
- I/O Density 284 user I/Os to support a broad set of parallel interfaces and board-level connections.
- Package & Mounting 780-BBGA (780-FBGA, FC 29×29) in a surface-mount package suitable for high-density PCB layouts.
- Power Core voltage specified at 0.900 V (900 mV).
- Operating Temperature Rated for 0 °C to 100 °C operation.
- Grade and Speed Extended grade device; corresponding Cyclone 10 GX documentation identifies -E6 as an available extended speed grade.
- Documentation Coverage Datasheet content for the Cyclone 10 GX family includes electrical characteristics, switching characteristics, configuration timing, and I/O timing details.
- RoHS Compliant The device is RoHS compliant.
Typical Applications
- Custom digital logic and control Implementation of user-defined state machines, protocol handlers, and control logic using the device’s logic elements and on-chip RAM.
- Data buffering and packet processing Large on-chip RAM supports buffering, FIFOs, and local data storage for packet handling and streaming data tasks.
- High-density I/O interfacing 284 I/Os provide the ability to aggregate multiple parallel interfaces and perform board-level protocol bridging.
Unique Advantages
- Significant logic scale: 104,000 logic elements enable implementation of complex digital designs without immediate need for external logic expansion.
- Substantial on-chip RAM: 8,641,536 bits of RAM reduce reliance on external memory for common buffering and temporary storage needs.
- High I/O count: 284 user I/Os accommodate multiple interfaces and control signals, simplifying system integration.
- Compact BGA package: 780-ball FBGA (29×29) balances high pin count with a compact footprint for space-constrained PCBs.
- Extended-grade operation: Extended-grade device and documented speed grading provide clear operating expectations within the specified 0 °C to 100 °C range.
- Complete technical documentation: Family datasheet provides electrical, configuration, and timing specifications that support design and validation activities.
Why Choose 10CX105YF780E6G?
The 10CX105YF780E6G positions itself as a high-capacity Cyclone 10 GX FPGA option, combining 104,000 logic elements with over 8.6 Mbits of on-chip RAM and 284 I/Os in a 780-ball FBGA package. Its extended-grade designation and the Cyclone 10 GX datasheet coverage make it suitable for projects that require documented electrical and configuration specifications alongside significant programmable logic and memory resources.
This device is appropriate for designs that need integrated logic and buffering, dense I/O connectivity, and a compact BGA footprint. The available technical documentation supports system-level integration, timing analysis, and configuration planning.
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