10CX105YF780E6G

IC FPGA 284 I/O 780FBGA
Part Description

Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 284 8641536 104000 780-BBGA, FCBGA

Quantity 969 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA, FC (29x29)GradeExtendedOperating Temperature0°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O284Voltage900 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38000Number of Logic Elements/Cells104000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8641536

Overview of 10CX105YF780E6G – Cyclone® 10 GX Field Programmable Gate Array (FPGA), 104000 logic elements, 8,641,536 bits RAM, 284 I/Os, 780-BBGA

The 10CX105YF780E6G is a Cyclone® 10 GX family FPGA in an extended grade offering. It provides a programmable logic fabric with 104,000 logic elements and 8,641,536 bits of on-chip RAM for implementing complex digital functions and buffering within system designs.

This device is supplied in a 780-ball fine-pitch BGA (780-BBGA / 780-FBGA, FC 29×29) surface-mount package, supports a core supply of 0.9 V, and operates over a 0 °C to 100 °C range. Documentation for the Cyclone 10 GX family includes detailed electrical, configuration, and I/O timing specifications.

Key Features

  • Logic Capacity  104,000 logic elements to implement sizable combinational and sequential logic networks.
  • On-Chip Memory  8,641,536 bits of total RAM for data buffering, FIFOs, and local storage.
  • I/O Density  284 user I/Os to support a broad set of parallel interfaces and board-level connections.
  • Package & Mounting  780-BBGA (780-FBGA, FC 29×29) in a surface-mount package suitable for high-density PCB layouts.
  • Power  Core voltage specified at 0.900 V (900 mV).
  • Operating Temperature  Rated for 0 °C to 100 °C operation.
  • Grade and Speed  Extended grade device; corresponding Cyclone 10 GX documentation identifies -E6 as an available extended speed grade.
  • Documentation Coverage  Datasheet content for the Cyclone 10 GX family includes electrical characteristics, switching characteristics, configuration timing, and I/O timing details.
  • RoHS Compliant  The device is RoHS compliant.

Typical Applications

  • Custom digital logic and control  Implementation of user-defined state machines, protocol handlers, and control logic using the device’s logic elements and on-chip RAM.
  • Data buffering and packet processing  Large on-chip RAM supports buffering, FIFOs, and local data storage for packet handling and streaming data tasks.
  • High-density I/O interfacing  284 I/Os provide the ability to aggregate multiple parallel interfaces and perform board-level protocol bridging.

Unique Advantages

  • Significant logic scale: 104,000 logic elements enable implementation of complex digital designs without immediate need for external logic expansion.
  • Substantial on-chip RAM: 8,641,536 bits of RAM reduce reliance on external memory for common buffering and temporary storage needs.
  • High I/O count: 284 user I/Os accommodate multiple interfaces and control signals, simplifying system integration.
  • Compact BGA package: 780-ball FBGA (29×29) balances high pin count with a compact footprint for space-constrained PCBs.
  • Extended-grade operation: Extended-grade device and documented speed grading provide clear operating expectations within the specified 0 °C to 100 °C range.
  • Complete technical documentation: Family datasheet provides electrical, configuration, and timing specifications that support design and validation activities.

Why Choose 10CX105YF780E6G?

The 10CX105YF780E6G positions itself as a high-capacity Cyclone 10 GX FPGA option, combining 104,000 logic elements with over 8.6 Mbits of on-chip RAM and 284 I/Os in a 780-ball FBGA package. Its extended-grade designation and the Cyclone 10 GX datasheet coverage make it suitable for projects that require documented electrical and configuration specifications alongside significant programmable logic and memory resources.

This device is appropriate for designs that need integrated logic and buffering, dense I/O connectivity, and a compact BGA footprint. The available technical documentation supports system-level integration, timing analysis, and configuration planning.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 10CX105YF780E6G.

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