10CX105YF672I6G

The 10CX105YF672I6G is an Intel Cyclone® 10 GX field programmable gate array supplied in a 672-ball FCBGA package. It provides a high-density programmable fabric with 104,000 logic elements and substantial on-chip memory to support complex logic, signal processing, and interface consolidation.

Designed for industrial-grade applications, this device offers 236 user I/Os, 8,641,536 total RAM bits, surface-mount packaging (672-FBGA, FC 27×27), RoHS compliance, and a specified operating range of –40 °C to 100 °C. The device datasheet includes configuration and transceiver performance specifications for system integration.

Key Features

• Logic Capacity  104,000 logic elements for implementing dense programmable logic and control functions.
• On-Chip Memory  8,641,536 total RAM bits to support buffering, packet processing, and embedded data storage.
• I/O Density  236 user I/Os to accommodate multiple interfaces and parallel connections on a single device.
• Package and Mounting  672-BBGA (672-FBGA, FC 27×27) surface-mount package suitable for compact PCB implementations.
• Power Supply  Core supply specified at 900 mV, enabling predictable power budgeting for system-level design.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C, matching industrial-environment requirements.
• Configuration and Transceivers  Device datasheet provides detailed configuration timing and transceiver performance specifications for system designers.
• RoHS Compliant  Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• Industrial Control and Automation  Industrial-grade operation and the –40 °C to 100 °C range support control logic, I/O aggregation, and factory automation use cases that require substantial logic and I/O counts.
• High-Density Logic and Signal Processing  104,000 logic elements together with 8.64 Mbits of on-chip RAM enable processing pipelines and custom datapaths for signal conditioning and real-time computation.
• Communications and Interface Bridging  The device datasheet includes transceiver performance specifications, and 236 I/Os provide the connectivity needed for protocol bridging and multi-interface communications endpoints.
• Embedded Platform Integration  The 672-ball FCBGA surface-mount package allows compact board-level integration for embedded applications that combine logic, memory, and rich I/O requirements.

Unique Advantages

• High logic density: 104,000 logic elements reduce the need for multiple devices by consolidating complex logic into a single FPGA.
• Significant on-chip memory: 8,641,536 RAM bits provide local storage for buffering and stateful processing without external memory in many designs.
• Broad connectivity: 236 I/Os enable flexible interface options and support for multiple parallel signals and buses.
• Industrial-ready thermal window: –40 °C to 100 °C rating allows deployment in demanding environments where temperature resilience is required.
• Compact board footprint: 672-FBGA, FC (27×27) package supports dense PCB layouts while maintaining serviceable pin count.
• Standards-conscious supply: RoHS compliance simplifies integration into modern, lead-free manufacturing flows.

Why Choose 10CX105YF672I6G?

The 10CX105YF672I6G Cyclone 10 GX FPGA delivers a balanced combination of high logic capacity, significant on-chip RAM, and extensive I/O in a compact industrial-grade FCBGA package. These attributes make it suitable for designs that require dense logic integration, on-chip buffering, and a wide range of external interfaces while operating across an extended industrial temperature range.

Backed by Intel documentation and device-level specifications, the part is appropriate for engineering teams seeking a programmable platform with clearly defined electrical, configuration, and transceiver performance data to support deterministic system integration and long-term procurement planning.

Request a quote or submit a procurement inquiry for the 10CX105YF672I6G to receive pricing and availability information. Refer to the Intel Cyclone 10 GX device datasheet for complete electrical and timing specifications.