10CX105YF672E5G

The 10CX105YF672E5G is a Cyclone® 10 GX field programmable gate array (FPGA) IC from Intel offered in an Extended grade (-E5) speed option. It provides a large fabric of configurable logic combined with substantial on-chip RAM and broad I/O connectivity in a 672-ball FCBGA package, making it suitable for designs that require dense programmable logic and integrated memory.

This device is described in the Cyclone 10 GX device datasheet, which details device electrical characteristics, configuration options, transceiver and I/O timing specifications useful for system-level integration and design planning.

Key Features

• Core Logic  104,000 logic elements (logic cells) provide the programmable fabric for implementing custom logic and control functions.
• On‑Chip Memory  Total on-chip RAM of 8,641,536 bits supports data buffering, LUT-based memory, and state storage within the FPGA fabric.
• Programmable I/O  236 user I/O pins enable connectivity to peripherals, sensors, and interfaces requiring significant parallel or multi‑lane I/O.
• Package & Mounting  672-BBGA (FCBGA) package, supplier package listed as 672-FBGA, FC (27×27), intended for surface-mount PCB assembly.
• Voltage Supply  Core voltage specified as 0.900 V (900 mV), matching the device supply requirement shown in the product data.
• Operating Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C; the part includes the -E5 extended speed grade.
• Design & Configuration Documentation  Supported by the Cyclone 10 GX device datasheet covering electrical characteristics, configuration timing, transceiver performance, and I/O timing for system integration.
• Regulatory Compliance  RoHS compliant per product data.

Typical Applications

• Custom Programmable Logic  Implementation of user-defined logic, control, and state machines where 104k logic elements are required.
• On‑chip Memory‑Heavy Designs  Applications that leverage the 8,641,536 bits of RAM for buffering, packet buffering, or shared memory structures.
• I/O‑Intensive Systems  Systems needing extensive parallel interfaces or multiple peripheral connections using the 236 I/O pins.
• Compact High‑Density Boards  Surface-mount 672‑ball FCBGA package for compact, high-density PCB implementations.

Unique Advantages

• Large Logic Capacity: 104,000 logic elements enable complex functions and large-scale integration within a single FPGA device.
• Substantial On‑Chip RAM: 8,641,536 bits of RAM reduce external memory dependence for many buffering and storage needs.
• Extensive I/O Connectivity: 236 I/O pins support rich peripheral interfacing and parallel data paths.
• Surface‑Mount FCBGA Packaging: 672-ball FCBGA (27×27) package allows high-density board layouts and reliable soldered assembly.
• Documented Integration Guidance: Comprehensive Cyclone 10 GX datasheet sections for electrical characteristics, configuration, transceivers, and I/O timing assist design validation and system integration.
• RoHS Compliance: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose 10CX105YF672E5G?

The 10CX105YF672E5G balances a large programmable fabric with significant on‑chip RAM and broad I/O in a compact 672-BBGA package. As an Extended grade Cyclone 10 GX device (-E5), it is presented with datasheet-backed electrical and configuration specifications to guide integration into complex programmable designs.

This part is suited for engineering teams needing a single-chip solution for dense logic implementation, on‑chip memory, and extensive I/O without expanding PCB footprint, supported by Cyclone 10 GX documentation for configuration and timing integration.

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