10CX085YU484E5G

IC FPGA 208 I/O 484UBGA
Part Description

Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 5959680 85000 484-FBGA

Quantity 53 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeExtendedOperating Temperature0°C – 100°C
Package / Case484-FBGANumber of I/O188Voltage900 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs31000Number of Logic Elements/Cells85000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5959680

Overview of 10CX085YU484E5G – Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 5959680 85000 484-FBGA

The 10CX085YU484E5G is an Intel Cyclone® 10 GX field programmable gate array (FPGA) in a 484-FBGA package designed for high-density, memory-rich programmable logic applications. It delivers 85,000 logic elements and approximately 5,959,680 bits of on-chip RAM, making it suitable for complex logic integration and embedded processing tasks.

With 188 user I/Os, surface-mount packaging, and an extended grade specification, this device targets designers who need significant programmable logic, substantial on-chip memory, and robust I/O capacity in a compact footprint.

Key Features

  • Core Logic  85,000 logic elements provide a large, flexible fabric for implementing custom logic, control functions, and moderate parallel processing.
  • On-chip Memory  Approximately 5,959,680 total RAM bits support buffering, packet processing, and local data storage to reduce external memory dependencies.
  • I/O Capacity  188 user I/Os enable dense external connectivity for sensors, peripherals, and interface bridging in compact designs.
  • Package & Mounting  484-FBGA (supplier package 484-UBGA, 19×19) in a surface-mount format simplifies PCB integration while conserving board area.
  • Power  Specified supply voltage is 0.900 V (listed as 900 mV), providing the device’s core supply requirement as documented in the product data.
  • Temperature & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C, suitable for many commercial and industrial-adjacent applications where extended-grade devices are required.
  • Configuration and Timing Guidance  Device datasheet includes configuration specifications, I/O timing, and related performance sections to support system integration and timing closure.
  • Compliance  RoHS compliant to support environmental and regulatory considerations in product builds.

Typical Applications

  • High-density logic integration  Use the 85,000 logic elements to consolidate multiple control and signal-processing functions into a single programmable device.
  • Memory-intensive processing  The ~5.96 Mb of on-chip RAM supports buffering, packet handling, and local data manipulation for embedded processing tasks.
  • I/O and protocol bridging  188 I/Os provide flexibility for interfacing to sensors, transceivers, and peripheral buses in communication and control systems.
  • Compact OEM modules  The 484-FBGA surface-mount package enables space-efficient PCB designs where board area and integration density matter.

Unique Advantages

  • Substantial logic density: 85,000 logic elements enable consolidation of complex functions and reduce the need for multiple discrete devices.
  • Ample on-chip RAM: Nearly 6 Mb of RAM lowers external memory requirements and improves data-path latency for streaming and buffering applications.
  • High I/O count in a compact package: 188 user I/Os in a 484-FBGA footprint balance connectivity and board-area efficiency for constrained designs.
  • Extended-grade reliability: Specified for 0 °C to 100 °C operation and labeled as Extended grade, supporting designs that require wider-than-normal commercial temperature range.
  • Standards-conscious supply: RoHS compliance simplifies regulatory alignment during product development and manufacturing.
  • Design and integration support: Detailed device datasheet coverage of electrical, configuration, and I/O timing characteristics aids system-level integration and verification.

Why Choose 10CX085YU484E5G?

The 10CX085YU484E5G positions itself as a high-density, memory-capable Cyclone® 10 GX FPGA option for designers needing significant programmable logic, substantial on-chip RAM, and extensive I/O in a compact FBGA package. Its extended-grade rating and documented configuration and I/O timing information help support robust integration into embedded systems, communication modules, and OEM platforms.

This device is well suited to teams building medium-to-high complexity programmable solutions who value integration, on-chip memory capacity, and a clear set of electrical and timing specifications for design validation and production planning.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the 10CX085YU484E5G.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up