10CX085YU484E5G
| Part Description |
Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 5959680 85000 484-FBGA |
|---|---|
| Quantity | 53 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 188 | Voltage | 900 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 31000 | Number of Logic Elements/Cells | 85000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5959680 |
Overview of 10CX085YU484E5G – Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 5959680 85000 484-FBGA
The 10CX085YU484E5G is an Intel Cyclone® 10 GX field programmable gate array (FPGA) in a 484-FBGA package designed for high-density, memory-rich programmable logic applications. It delivers 85,000 logic elements and approximately 5,959,680 bits of on-chip RAM, making it suitable for complex logic integration and embedded processing tasks.
With 188 user I/Os, surface-mount packaging, and an extended grade specification, this device targets designers who need significant programmable logic, substantial on-chip memory, and robust I/O capacity in a compact footprint.
Key Features
- Core Logic 85,000 logic elements provide a large, flexible fabric for implementing custom logic, control functions, and moderate parallel processing.
- On-chip Memory Approximately 5,959,680 total RAM bits support buffering, packet processing, and local data storage to reduce external memory dependencies.
- I/O Capacity 188 user I/Os enable dense external connectivity for sensors, peripherals, and interface bridging in compact designs.
- Package & Mounting 484-FBGA (supplier package 484-UBGA, 19×19) in a surface-mount format simplifies PCB integration while conserving board area.
- Power Specified supply voltage is 0.900 V (listed as 900 mV), providing the device’s core supply requirement as documented in the product data.
- Temperature & Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C, suitable for many commercial and industrial-adjacent applications where extended-grade devices are required.
- Configuration and Timing Guidance Device datasheet includes configuration specifications, I/O timing, and related performance sections to support system integration and timing closure.
- Compliance RoHS compliant to support environmental and regulatory considerations in product builds.
Typical Applications
- High-density logic integration Use the 85,000 logic elements to consolidate multiple control and signal-processing functions into a single programmable device.
- Memory-intensive processing The ~5.96 Mb of on-chip RAM supports buffering, packet handling, and local data manipulation for embedded processing tasks.
- I/O and protocol bridging 188 I/Os provide flexibility for interfacing to sensors, transceivers, and peripheral buses in communication and control systems.
- Compact OEM modules The 484-FBGA surface-mount package enables space-efficient PCB designs where board area and integration density matter.
Unique Advantages
- Substantial logic density: 85,000 logic elements enable consolidation of complex functions and reduce the need for multiple discrete devices.
- Ample on-chip RAM: Nearly 6 Mb of RAM lowers external memory requirements and improves data-path latency for streaming and buffering applications.
- High I/O count in a compact package: 188 user I/Os in a 484-FBGA footprint balance connectivity and board-area efficiency for constrained designs.
- Extended-grade reliability: Specified for 0 °C to 100 °C operation and labeled as Extended grade, supporting designs that require wider-than-normal commercial temperature range.
- Standards-conscious supply: RoHS compliance simplifies regulatory alignment during product development and manufacturing.
- Design and integration support: Detailed device datasheet coverage of electrical, configuration, and I/O timing characteristics aids system-level integration and verification.
Why Choose 10CX085YU484E5G?
The 10CX085YU484E5G positions itself as a high-density, memory-capable Cyclone® 10 GX FPGA option for designers needing significant programmable logic, substantial on-chip RAM, and extensive I/O in a compact FBGA package. Its extended-grade rating and documented configuration and I/O timing information help support robust integration into embedded systems, communication modules, and OEM platforms.
This device is well suited to teams building medium-to-high complexity programmable solutions who value integration, on-chip memory capacity, and a clear set of electrical and timing specifications for design validation and production planning.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the 10CX085YU484E5G.

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