10CX085YF672E5G

The 10CX085YF672E5G is an Intel Cyclone® 10 GX field-programmable gate array (FPGA) in an extended grade (-E5) offering. It provides a high-density, programmable logic fabric with substantial on-chip RAM and a broad set of I/O, packaged in a compact 672-ball BGA.

Designed for applications that require significant programmable logic capacity and embedded memory, this device delivers 85,000 logic elements, 5,959,680 bits of on-chip RAM, and 216 user I/O pins while operating from a 0.9 V core supply over a 0 °C to 100 °C junction range.

Key Features

• Logic Capacity — 85,000 logic elements to implement high-density digital designs and complex logic architectures.
• Embedded Memory — 5,959,680 total RAM bits for buffering, packet memory, and on-chip data storage.
• I/O Resources — 216 user I/O pins to support multiple external interfaces and board-level connectivity.
• Package & Mounting — 672‑BGA (supplier package: 672‑FBGA, 27×27) in a surface-mount package for compact board integration.
• Power — Core voltage specified at 900 mV (0.9 V) to match system power-rail planning.
• Temperature & Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Configuration & Timing Documentation — Datasheet coverage includes electrical characteristics, switching characteristics, configuration specifications, and I/O timing for system integration and validation.
• Standards Compliance — RoHS compliant for regulatory and environmental requirements.

Typical Applications

• Communications & Networking — On-chip RAM and logic density enable packet processing, protocol implementation, and protocol offload functions.
• High-density Digital Systems — 85,000 logic elements support complex control, state machines, and custom hardware accelerators.
• Embedded Systems & Peripherals — 216 I/Os allow integration with sensors, memory interfaces, and peripheral controllers on compact PCBs.

Unique Advantages

• Significant Logic Density: 85,000 logic elements provide capacity for large FPGA designs without moving to a larger package footprint.
• Ample On-chip RAM: Nearly 6 Mbits of embedded RAM reduces dependence on external memory for many buffering and local storage needs.
• Flexible I/O Count: 216 user I/Os give designers the ability to implement multiple interfaces and parallel connections on a single device.
• Compact BGA Package: The 672‑FBGA (27×27) offers a high pin-count in a compact area for dense board layouts.
• Documented Configuration & Timing: Extensive datasheet coverage for electrical, switching, and configuration specifications supports system validation and timing closure.
• Extended Grade Reliability: -E5 extended grade and a 0 °C to 100 °C operating range for reliable operation in many commercial and industrial-adjacent environments.

Why Choose 10CX085YF672E5G?

The 10CX085YF672E5G combines large logic capacity and substantial on-chip RAM in a compact 672‑BGA package, making it well suited for designs that demand dense programmable logic, significant local memory, and a high I/O count. Its extended-grade designation and documented electrical and configuration specifications make integration and validation straightforward for development and production workflows.

This device is a practical choice for teams building complex digital systems, communication subsystems, and embedded platforms that require a balance of logic density, embedded memory, and board-level I/O in a space-conscious package.

Request a quote or submit a sales inquiry to receive pricing, lead-time, and availability for the 10CX085YF672E5G. Our team can provide configuration and procurement information to support your design timeline.