10CL120YF780I7G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 525 3981312 119088 780-BGA |
|---|---|
| Quantity | 43 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 525 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7443 | Number of Logic Elements/Cells | 119088 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3981312 |
Overview of 10CL120YF780I7G – Cyclone® 10 LP FPGA, 780-BGA
The 10CL120YF780I7G is an Intel Cyclone® 10 LP field-programmable gate array (FPGA) in a 780-ball FBGA package. It is an industrial-grade device featuring a standard 1.2 V core option and is specified for operation from –40 °C to 100 °C.
Designed for applications that require significant programmable logic, on-chip RAM, and a high I/O count in a compact surface-mount package, this device delivers substantial integration capacity while conforming to Cyclone 10 LP device electrical and configuration specifications.
Key Features
- Logic Capacity 119,088 logic elements available for implementing complex combinatorial and sequential logic.
- Embedded Memory 3,981,312 total RAM bits for buffers, FIFOs, and on-chip data storage.
- I/O Density 525 user I/Os to support extensive peripheral and board-level connectivity.
- Core Voltage Standard core voltage option: 1.2 V (designated by the "Y" option in the part number).
- Package & Mounting 780-ball FBGA (29 × 29) surface-mount package for compact board integration.
- Industrial Temperature Range Rated for operation from –40 °C to 100 °C, suitable for industrial environment deployments.
- Comprehensive Device Specification Device datasheet provides electrical, switching, I/O timing, configuration, and power consumption characteristics for design and qualification.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- Industrial Control Programmable logic and robust temperature rating make the device suitable for automation controllers, motor drives, and PLC subsystems.
- Communication Interfaces High I/O count and significant logic resources enable protocol bridging, packet processing, and custom interface implementations.
- Instrumentation and Measurement On-chip RAM and abundant logic elements support data buffering, signal processing, and real-time control functions.
Unique Advantages
- High Integration Density: 119,088 logic elements reduce the need for external glue logic and discrete components.
- Substantial On-Chip Memory: Nearly 4 Mbits of RAM for efficient on-device data handling and reduced external memory dependence.
- Large I/O Count: 525 I/Os enable direct interfacing with numerous sensors, transceivers, and peripherals.
- Industrial Ready: Rated for –40 °C to 100 °C to meet demanding temperature requirements in industrial deployments.
- Single 1.2 V Core Rail: Standard 1.2 V core simplifies power-rail design when using the "Y" core option.
- Compact FBGA Package: 780-FBGA (29 × 29) minimizes PCB area while providing high pin density.
Why Choose 10CL120YF780I7G?
The 10CL120YF780I7G positions itself as a high-capacity Cyclone® 10 LP FPGA optimized for industrial applications that require a combination of large logic resources, substantial on-chip RAM, and extensive I/O in a compact BGA package. Its 1.2 V core option and device-level specifications provide a clear foundation for power-rail and thermal planning.
This device is well suited to engineers and system designers implementing complex control logic, custom interfaces, and on-FPGA data handling where robustness, integration density, and a defined industrial temperature range are key selection criteria.
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