10CX085YF672E6G

The 10CX085YF672E6G is an Intel Cyclone® 10 GX field programmable gate array (FPGA) offered in an extended grade. The device provides a combination of on‑chip programmable logic, embedded RAM, and a high I/O count in a 672‑ball BGA package.

With 85,000 logic elements, 5,959,680 total RAM bits and 216 user I/O, this FPGA is designed for designs that require substantial programmable logic capacity, significant on‑chip memory, and dense I/O routing while operating within a 0 °C to 100 °C temperature range.

Key Features

• Core and Family  Intel Cyclone 10 GX device family; available in extended speed grades including the -E6 speed grade associated with this part number.
• Logic Capacity  85,000 logic elements for implementing complex digital logic and custom hardware functions.
• Embedded Memory  5,959,680 total RAM bits to support on‑chip buffering, FIFOs, and memory‑intensive logic.
• I/O  216 user I/O pins to support dense connectivity and multiple peripheral interfaces.
• Package & Mounting  672‑BGA package (supplier device package: 672‑FBGA, 27×27) with surface‑mount mounting for compact board designs.
• Power  Specified core voltage supply of 900 mV (range shown as 900 mV to 900 mV in the product data).
• Operating Temperature  Rated for operation from 0 °C to 100 °C.
• Compliance  RoHS compliant.
• Documentation and Performance Topics  Datasheet coverage includes electrical characteristics, switching characteristics, transceiver performance specifications, configuration timing, and I/O timing.

Unique Advantages

• Significant programmable logic capacity: 85,000 logic elements enable implementation of sizable custom hardware functions without immediate external logic expansion.
• Large on‑chip RAM resource: Nearly 6 Mb of total RAM bits supports buffering and data‑path storage directly within the FPGA fabric, simplifying system memory architecture.
• High I/O density: 216 user I/Os accommodate multiple interfaces and signals, reducing the need for external I/O expanders.
• Compact, surface‑mount BGA package: 672‑FBGA (27×27) helps maintain a small board footprint while providing the routing density required by complex designs.
• Extended‑grade speed option: The device is offered in extended grade with the -E6 speed grade indicated by the part number for designs targeting that performance tier.
• Complete device documentation: Datasheet topics include electrical, timing, configuration, and transceiver specifications to support design and validation.

Why Choose 10CX085YF672E6G?

The 10CX085YF672E6G delivers a balance of substantial logic capacity, on‑chip memory, and high I/O density in a compact 672‑ball BGA package. Its extended‑grade designation and the datasheet coverage of electrical, timing, and transceiver specifications make it suitable for projects that need verifiable device characteristics and robust documentation.

This part is appropriate for engineers and procurement teams building systems that require dense programmable logic, integrated RAM resources, and extensive I/O in a surface‑mount FPGA. The combination of device specifications provides a clear basis for evaluating fit in mid‑ to higher‑complexity FPGA designs.

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