10CL120ZF780I8G

IC FPGA 525 I/O 780FBGA
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 525 3981312 119088 780-BGA

Quantity 175 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BGANumber of I/O525Voltage1 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7443Number of Logic Elements/Cells119088
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3981312

Overview of 10CL120ZF780I8G – Cyclone® 10 LP Field Programmable Gate Array (FPGA) 780-BGA

The 10CL120ZF780I8G is an Intel Cyclone® 10 LP family FPGA in a 780-FBGA (29×29) package. It provides a substantial logic fabric and on-chip memory with a broad I/O count, delivered in an industrial-grade device with a 1.0 V core supply and an operating temperature range of −40 °C to 100 °C.

This device targets embedded and industrial designs that require high logic density, significant embedded RAM, and extensive I/O connectivity within a compact BGA footprint.

Key Features

  • Logic Capacity  119,088 logic elements providing the core programmable fabric for custom logic, state machines, and data-path implementations.
  • Logic Array Blocks (LABs)  7,443 LABs for organized logic partitioning and predictable resource planning.
  • Embedded Memory  3,981,312 total RAM bits to support buffers, FIFOs, and on-chip data storage.
  • I/O Density  525 user I/O pins to enable wide peripheral and bus interfacing options.
  • Package  780-ball FBGA (29×29) package for a compact, high-pin-count footprint.
  • Power and Voltage  Core voltage supply at 1.0 V (specified as 1 V to 1 V) consistent with the Cyclone 10 LP lower core-voltage option.
  • Industrial Temperature Range  Specified operation from −40 °C to 100 °C for deployment in industrial environments.
  • RoHS Compliance  Device is RoHS compliant for environmental and regulatory alignment.

Unique Advantages

  • High logic density: 119,088 logic elements enable complex custom logic and data processing on a single device, reducing external component count.
  • Large on-chip RAM: Nearly 4 million RAM bits support buffering and storage needs without requiring external memory in many applications.
  • Extensive I/O: 525 I/O pins provide flexibility for parallel interfaces, multiple serial links, and broad sensor/actuator connectivity.
  • Industrial-grade operation: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
  • Compact, high-pin-count package: 780-FBGA (29×29) delivers high connectivity in a space-efficient footprint.
  • Regulatory readiness: RoHS compliance simplifies regulatory alignment for assemblies and systems.

Why Choose 10CL120ZF780I8G?

The 10CL120ZF780I8G combines substantial logic resources, abundant embedded RAM, and high I/O density in a compact 780-FBGA package, making it well suited for industrial and embedded designs that require on-chip capacity and connectivity within a controlled thermal envelope. Its 1.0 V core supply and series documentation from the Cyclone 10 LP family support predictable power budgeting and design integration.

This FPGA is appropriate for engineering teams and procurement focused on scalable, robust programmable logic solutions backed by Intel’s Cyclone 10 LP device specifications and documentation.

If you would like pricing, availability, or a formal quote for the 10CL120ZF780I8G, submit an inquiry or request a quote and include your required quantity and target delivery timeframe.

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