10CL120YF780C8G

The 10CL120YF780C8G is an Intel Cyclone® 10 LP field-programmable gate array (FPGA) supplied in a 780-ball fine-pitch BGA (29×29 mm) package. It delivers a large logic fabric and on-chip RAM suitable for high-density commercial applications that require extensive I/O and embedded memory.

With 119,088 logic elements, 3,981,312 total RAM bits, and 525 I/O pins, this surface-mount device targets commercial embedded systems, communications interfaces, and platform-integrated logic where high logic capacity, abundant I/O, and a compact BGA package are required. The device is specified for operation at a 1.2 V core supply and a commercial temperature range of 0 °C to 85 °C, and it is RoHS compliant.

Key Features

• Logic Capacity 119,088 logic elements provide substantial programmable logic resources for complex combinational and sequential designs.
• On-Chip Memory 3,981,312 total RAM bits support buffering, FIFOs, and embedded data structures without external memory in many designs.
• I/O Density 525 I/O pins enable wide parallel interfaces, multiple high-pin-count peripherals, and extensive board-level connectivity.
• Package 780-FBGA (29×29 mm) surface-mount package delivers a compact, high-pin-count footprint for space-constrained PCBs.
• Power Standard core voltage: 1.2 V, matching the Cyclone 10 LP standard core option for designs that use a 1.2 V core supply.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for commercial electronics environments.
• Environmental Compliance RoHS compliant to support regulatory requirements for lead-free manufacturing.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, protocol bridging, and data processing functions within compact electronic products.
• Communications Equipment — Provide dense I/O and programmable logic for interface conversion, packet handling, or custom PHY adaptation in commercial networking gear.
• Instrumentation & Test — Build flexible measurement, data-acquisition, and signal-conditioning front ends that leverage on-chip RAM and high I/O counts.
• Prototyping and Development Platforms — Use the device as a scalable platform for prototyping complex logic designs before final integration.

Unique Advantages

• High Logic Density: 119,088 logic elements enable implementation of complex state machines, datapaths, and control logic without immediate need for multiple devices.
• Large Embedded RAM: Nearly 4 Mbits of on-chip RAM reduce dependence on external memory for buffering and temporary storage, simplifying BOM and board layout.
• Extensive I/O Count: 525 I/Os allow broad peripheral connectivity and parallel interfaces, minimizing the need for external I/O expanders.
• Compact BGA Footprint: 780-FBGA (29×29 mm) provides a high-pin-count solution in a compact surface-mount package suitable for dense PCBs.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, matching typical commercial product deployments.
• RoHS Compliant: Supports lead-free assembly and regulatory compliance for commercial manufacturing.

Why Choose 10CL120YF780C8G?

The 10CL120YF780C8G offers a balanced combination of large programmable logic capacity, substantial on-chip RAM, and a very high I/O count in a compact 780-ball FBGA package. Its 1.2 V core and commercial temperature grade make it suitable for mainstream embedded and communications applications where board space, I/O density, and embedded memory are primary design drivers.

For design teams needing a commercially rated Cyclone® 10 LP device with verified datasheet specifications and RoHS compliance, this part delivers a predictable, scalable platform supported by detailed device documentation.

Request a quote or submit an inquiry for pricing and availability to begin integrating the 10CL120YF780C8G into your next commercial FPGA design.