10CL120YF484I7G

The 10CL120YF484I7G is an Intel Cyclone® 10 LP field-programmable gate array (FPGA) offered in an industrial-grade package. It delivers a substantial logic capacity and on-chip RAM with a high I/O count in a compact 484-ball BGA footprint, making it suitable for industrial and embedded system designs that require robust temperature range and board-level integration.

Key value drivers include a large pool of logic elements, nearly 4 Mbit of total RAM, a fixed 1.2 V core supply, and surface-mount 484-FBGA (23×23) packaging — providing designers with a balanced combination of integration, I/O density, and environmental robustness.

Key Features

• Logic Capacity  119,088 logic elements provide the resources to implement complex custom logic, control functions, and moderate gate-count designs.
• On-chip Memory  Total RAM capacity of 3,981,312 bits supports buffering, state storage, and intermediate data processing without external memory in many use cases.
• I/O Density  277 device I/Os accommodate dense sensor, actuator, and peripheral interfacing or multi-protocol I/O arrangements on a single device.
• Package & Mounting  484-ball FBGA in a 23×23 arrangement with surface-mount mounting simplifies board integration for volume production and compact PCB layouts.
• Voltage Supply  Core supply fixed at 1.2 V, matching the device’s standard core voltage option for consistent power planning on the PCB.
• Industrial Operating Range  Rated for operation from –40 °C to 100 °C, supporting deployment in industrial environments and temperature-challenged applications.
• Compliance  RoHS compliant for regulations on hazardous substances and environmental considerations.

Typical Applications

• Industrial control systems  Suitable for control logic, sequencing, and I/O aggregation where an industrial temperature range and high I/O count are required.
• Protocol bridging and I/O expansion  Use the device’s 277 I/Os and large logic capacity to implement protocol conversion, bus bridging, or I/O consolidation on compact PCBs.
• Embedded processing and custom logic  Leverage 119,088 logic elements and on‑chip RAM for custom accelerators, state machines, and embedded control functions.
• Ruggedized equipment  Industrial-grade temperature rating and surface-mount BGA packaging make it a fit for equipment deployed in factory or field environments.

Unique Advantages

• High integration density: Large logic element count and substantial on-chip RAM reduce the need for multiple discrete components and simplify system architecture.
• Wide I/O capability: 277 device I/Os enable high-pin-count interfacing without resorting to multiple devices, lowering BOM complexity.
• Industrial temperature qualification: Operation from –40 °C to 100 °C supports reliable performance in harsh or variable environments.
• Compact, production-ready package: 484-FBGA (23×23) surface-mount packaging supports high-density board designs and automated assembly.
• Predictable power planning: Single core voltage rating of 1.2 V simplifies power-rail design and thermal budgeting.
• Regulatory readiness: RoHS compliance helps streamline environmental and regulatory acceptance for product builds.

Why Choose 10CL120YF484I7G?

The 10CL120YF484I7G positions itself as a practical choice for industrial and embedded designs needing a high logic element count, substantial on-chip RAM, and a large number of I/Os in a compact BGA package. Its 1.2 V core voltage and RoHS compliance simplify power and regulatory planning, while the extended operating temperature range supports deployment in demanding environments.

Design teams targeting protocol bridging, complex control logic, or embedded custom acceleration will find the device’s combination of capacity, I/O density, and industrial temperature rating aligned with long-term product robustness and integration goals.

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