10CL080ZF484I8G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 289 2810880 81264 484-BGA |
|---|---|
| Quantity | 1,219 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 289 | Voltage | 1 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5079 | Number of Logic Elements/Cells | 81264 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2810880 |
Overview of 10CL080ZF484I8G – Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 484-BGA
The 10CL080ZF484I8G is a Cyclone® 10 LP FPGA in a 484-ball BGA package designed for industrial-grade embedded systems. It provides a substantial logic and memory resource set—81,264 logic elements and 2,810,880 total RAM bits—along with a high I/O count to support complex custom digital functions.
Targeted at designs that require low core voltage operation and broad I/O integration, this device combines Cyclone 10 LP architecture with a 1.0 V core option and an industrial operating temperature range to address demanding environmental conditions.
Key Features
- Logic Capacity Provides 81,264 logic elements to implement sizable custom logic, state machines, and data-path functions.
- On‑chip Memory Includes 2,810,880 total RAM bits for buffering, FIFOs, and embedded data storage.
- I/O Resources 289 device I/Os to support dense peripheral and interface connectivity in a single FPGA package.
- Core Voltage Operates with a 1.0 V core supply option (Cyclone 10 LP lower core voltage "Z" option for –I8 speed grade), supporting low-voltage system architectures.
- Package & Mounting 484-BGA (484-FBGA, 23×23) surface-mount package enabling compact board-level integration.
- Industrial Temperature Range Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
- Compliance RoHS compliant.
Typical Applications
- Industrial Control & Automation Use the device’s large logic array and 289 I/Os to implement custom control logic, I/O aggregation, and deterministic processing for industrial equipment.
- Embedded System Acceleration Leverage 81,264 logic elements and ample on‑chip RAM to offload compute-intensive tasks and accelerate real-time processing in embedded platforms.
- Interface Bridging & Custom Peripherals High I/O count and flexible packaging make the device suitable for implementing protocol bridges, custom peripheral logic, and board-level integration where multiple interfaces are required.
Unique Advantages
- High Logic Density: 81,264 logic elements enable complex designs and large finite-state machines within a single FPGA.
- Substantial On‑Chip Memory: 2,810,880 RAM bits reduce external memory dependence for many buffering and data‑path tasks.
- Extensive I/O Integration: 289 I/Os simplify system-level routing and reduce the need for external interface components.
- Low‑Voltage Core Option: 1.0 V core operation (Z option for –I8) supports lower-power system architectures and compatibility with modern power domains.
- Industrial Temperature Capability: Rated –40 °C to 100 °C for reliable operation in industrial environments.
- Compact BGA Packaging: 484-FBGA (23×23) surface-mount package balances I/O count and board space for dense designs.
Why Choose 10CL080ZF484I8G?
The 10CL080ZF484I8G delivers a balanced combination of logic capacity, on‑chip memory, and I/O density in an industrial‑rated Cyclone® 10 LP device. Its 1.0 V core option and broad operating temperature range make it well suited for embedded and industrial applications requiring robust operation and efficient power domains.
This part is a strong fit for engineering teams designing systems that need sizable programmable logic, extensive peripheral connectivity, and the thermal margin required for industrial deployments. Its RoHS compliance and BGA packaging simplify BOM and board-level integration for production designs.
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