10CL080ZF780I8G

The 10CL080ZF780I8G is an Intel Cyclone® 10 LP FPGA supplied in a 780-ball BGA package (supplier package: 780-FBGA, 29×29) with a surface-mount profile. This device delivers substantial on-chip logic and memory resources together with a high I/O count, making it suitable for industrial systems that require significant programmable logic capacity and connectivity.

Key device attributes include 81,264 logic elements, 2,810,880 total RAM bits, and 423 I/O pins. The device is specified for industrial operation with a core supply of 1.0 V and an operating temperature range of –40 °C to 100 °C.

Key Features

• Core & logic capacity  81,264 logic elements provide broad programmable logic resources for complex FPGA designs.
• On-chip memory  2,810,880 total RAM bits support local buffering, frame storage, and data-path implementations.
• I/O density  423 available I/O pins enable extensive external connectivity for peripherals, sensors, and high-pin-count interfaces.
• Power  Core supply specified at 1.0 V, aligning with the device's lower-voltage core option.
• Package & mounting  780-ball BGA (780-FBGA, 29×29) surface-mount package for compact board-area integration and reliable solder attachment.
• Operating conditions & grade  Industrial grade device with an operating temperature range of –40 °C to 100 °C for use in harsher environments.
• Environmental compliance  RoHS compliant to support environmentally conscious designs and regulatory requirements.

Unique Advantages

• High logic density: 81,264 logic elements give designers the capacity to implement large state machines, datapaths, and custom hardware accelerators on a single device.
• Substantial on-chip RAM: 2,810,880 bits of RAM reduce reliance on external memory for many buffering and storage tasks, simplifying board design.
• Extensive I/O connectivity: 423 I/O pins enable direct interfacing to multiple peripherals and parallel buses without immediate need for additional I/O expanders.
• Industrial temperature capability: Specified for –40 °C to 100 °C operation and designated as Industrial grade, supporting deployment in temperature-challenging environments.
• Compact BGA form factor: 780-FBGA (29×29) package provides a balance of high pin count and compact PCB footprint for dense system designs.
• RoHS compliant: Conforms to RoHS requirements for environmentally responsible manufacturing.

Why Choose 10CL080ZF780I8G?

The 10CL080ZF780I8G combines a large logic element count, significant on-chip memory, and a high number of I/O pins in a compact 780-ball BGA package, making it well suited for industrial designs that need substantial programmable resources and extensive external connectivity. Its 1.0 V core supply and specified operating range of –40 °C to 100 °C support stable operation in industrial environments.

This device is appropriate for engineering teams and procurement focused on integrating a high-capacity Cyclone® 10 LP FPGA into systems where logic density, on-chip RAM, and I/O breadth are primary selection criteria.

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