10CX085YF672I6G

The 10CX085YF672I6G is an Intel Cyclone® 10 GX FPGA in a 672-ball BGA package designed for industrial-grade embedded applications. It provides a combination of programmable logic, on-chip RAM, and a high pin count to support complex I/O and mid-density logic integration.

Key hardware attributes include 85,000 logic elements, 5,959,680 total RAM bits, 216 I/O pins, surface-mount 672-FBGA (27×27) packaging, and an operating temperature range of −40 °C to 100 °C—making it suitable for robust industrial environments that require dense, reconfigurable logic and memory resources.

Key Features

• Programmable Logic  85,000 logic elements provide significant capacity for custom logic, state machines, and glue-logic functions.
• On-chip Memory  Total RAM capacity of 5,959,680 bits for buffering, FIFOs, and embedded data storage.
• I/O Density  216 configurable I/O pins to support multiple interfaces and wide peripheral connectivity.
• Package and Mounting  672-ball FBGA (27×27) package with surface-mount mounting for compact PCB integration and high pin density.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Power Supply  Core supply defined at 900 mV (0.9 V) per product specification.
• Compliance  RoHS-compliant construction for regulatory and assembly requirements.
• Datasheet Coverage  Comprehensive documentation describes electrical characteristics, switching characteristics, transceiver performance specifications, configuration specifications, and I/O timing.

Typical Applications

• Industrial Control  Programmable logic and extended temperature rating support control, automation, and factory equipment requiring reliable operation across wide temperatures.
• Communications and Interface Bridging  High I/O count and on-chip memory enable protocol bridging, packet buffering, and custom interface implementations.
• Embedded System Glue Logic  Use the device to integrate and offload control tasks, timing-critical glue logic, and custom accelerators within embedded platforms.

Unique Advantages

• Substantial Logic Capacity:  85,000 logic elements let designers implement complex finite-state machines, data-paths, and custom logic without external ASICs.
• Large On-Chip RAM:  Nearly 6 million bits of RAM reduce dependence on external memory for buffering and real-time data handling.
• High Pin Count in Compact Package:  672-FBGA (27×27) delivers a high I/O density in a compact surface-mount form factor to minimize PCB area.
• Industrial Ready:  Rated −40 °C to 100 °C and RoHS-compliant, aligning with industrial deployment and assembly requirements.
• Documented Electrical and Configuration Guidance:  Datasheet content covers electrical, switching, configuration, and transceiver performance details to support design and validation.

Why Choose 10CX085YF672I6G?

The 10CX085YF672I6G balances mid- to high-density programmable logic with substantial on-chip memory and a high I/O count in an industrial-grade package. Its defined supply and thermal specifications make it a practical choice for embedded systems and industrial designs that require field-programmable flexibility and robust environmental tolerance.

Designers seeking scalable FPGA resources with documented electrical and configuration guidance will find this Cyclone® 10 GX device suited to applications that need reconfigurable logic, on-chip buffering, and dense I/O in a compact BGA footprint.

Request a quote or submit a product inquiry to obtain pricing, availability, and ordering information for the 10CX085YF672I6G.