10CX085YF672I5G

IC FPGA 212 I/O 672FBGA
Part Description

Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 216 5959680 85000 672-BGA

Quantity 1,258 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BGANumber of I/O216Voltage900 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs31000Number of Logic Elements/Cells85000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5959680

Overview of 10CX085YF672I5G – Cyclone® 10 GX Field Programmable Gate Array (FPGA) 672-BGA

The 10CX085YF672I5G is an Intel Cyclone® 10 GX field programmable gate array (FPGA) supplied in a 672-ball BGA package. This industrial-grade device (–I5 speed/grade) delivers a high-density programmable fabric with on-chip memory and a substantial I/O count for complex, space-constrained designs.

Key value propositions are its logic and memory capacity, broad I/O capability, and an extended operating range suited for industrial environments, all in a compact 672-FBGA (27 × 27 mm) surface-mount package.

Key Features

  • Core Logic — 31,000 CLBs and 85,000 logic elements (cells) provide the programmable resources to implement complex logic and control functions.
  • On-Chip Memory — Total RAM of 5,959,680 bits available for buffers, FIFOs, and intermediate storage.
  • I/O Density — 216 I/O pins to support multiple interfaces and external peripherals.
  • Package & Mounting — 672-BGA (supplier package: 672-FBGA, 27 × 27 mm) in a surface-mount form factor for high-pin-count board designs.
  • Power — Specified voltage supply at 900 mV.
  • Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C, suitable for temperature-demanding deployments.
  • Regulatory — RoHS compliant.
  • Manufacturer — Intel Cyclone 10 GX family device, with datasheet and device documentation available from the manufacturer.

Unique Advantages

  • High logic density: 85,000 logic elements and 31,000 CLBs enable implementation of sophisticated digital functions without external glue logic.
  • Substantial on-chip RAM: Nearly 6 Mb of embedded RAM supports buffering and local data storage to reduce external memory dependency.
  • Robust I/O capacity: 216 I/O pins provide flexibility to interface multiple sensors, controllers, and peripheral devices directly.
  • Industrial temperature rating: −40 °C to 100 °C operating range supports deployments in harsh or temperature-variable environments.
  • Compact, high-pin-count package: 672-FBGA (27 × 27 mm) balances board-area efficiency with a large signal and power pin count for complex systems.
  • RoHS compliant: Conforms to lead-free manufacturing requirements for environmental compliance.

Why Choose 10CX085YF672I5G?

The 10CX085YF672I5G positions itself as a high-density, industrial-grade Cyclone 10 GX FPGA that brings together significant logic capacity, on-chip memory, and broad I/O in a compact BGA package. It is appropriate for designers seeking a programmable solution with defined operating limits and compliance characteristics for industrial deployments.

Backed by Intel’s Cyclone 10 GX device documentation and specified electrical and environmental parameters, this part supports scalable designs that require abundant logic resources, on-chip RAM, and a high I/O count while meeting industrial temperature requirements.

Request a quote or submit an inquiry to get pricing, availability, and ordering information for the 10CX085YF672I5G.

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