10CX105YF672I5G

The 10CX105YF672I5G is an Intel Cyclone 10 GX field‑programmable gate array supplied in a 672‑FBGA (27×27) FCBGA surface‑mount package. This industrial‑grade device provides a high logic capacity and on‑chip RAM to implement custom digital logic, I/O aggregation, and system control functions.

Key hardware characteristics include 104,000 logic elements, 8,641,536 bits of total RAM, 236 user I/Os, a nominal core supply of 900 mV, and an operating temperature range of -40 °C to 100 °C—specifications that support robust deployment in industrial environments requiring configurable logic and dense I/O integration.

Key Features

• Core Logic — 104,000 logic elements for implementing complex programmable logic, state machines, and custom accelerators.
• Embedded Memory — 8,641,536 total RAM bits to support buffering, packet/stream handling, and embedded data storage for logic functions.
• I/O Density — 236 user I/Os to connect multiple peripherals, sensors, and external interfaces directly to the FPGA fabric.
• Industrial Grade and Speed — Supplied as an industrial grade device (I5 speed grade), suitable for applications requiring rated operation from -40 °C to 100 °C.
• Package & Mounting — 672‑FBGA (27×27) FCBGA surface‑mount package for compact, high‑pin‑count board designs.
• Supply Voltage — Core supply specified at 900 mV.
• Standards Compliance — RoHS compliant for restriction of hazardous substances.

Typical Applications

• Industrial Control & Automation — Use the device's logic capacity and 236 I/Os to implement custom control logic, I/O aggregation, and real‑time interfacing in industrial systems.
• System Integration & Prototyping — Dense logic and embedded RAM enable rapid development of custom data paths, protocol bridging, and system glue logic on a single device.
• High‑density Digital Designs — Deploy the FPGA where significant programmable logic and on‑chip RAM are required in a compact BGA footprint operating across industrial temperature ranges.

Unique Advantages

• High Logic Capacity: 104,000 logic elements allow implementation of sizable custom logic blocks without partitioning across multiple devices.
• Substantial On‑Chip RAM: 8.64 Mb of RAM supports buffering, packet processing, and state retention close to the logic fabric.
• Extensive I/O Count: 236 user I/Os reduce the need for external I/O expanders and simplify board routing for complex systems.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to match demanding environmental requirements in industrial deployments.
• Compact, High‑pin Package: 672‑FBGA FCBGA (27×27) provides a high I/O count in a space‑efficient BGA footprint for dense board designs.
• Regulatory Compliance: RoHS compliance supports regulatory and environmental requirements for electronic assemblies.

Why Choose 10CX105YF672I5G?

The 10CX105YF672I5G combines substantial programmable logic, significant embedded RAM, and a high I/O count in an industrial‑rated package—making it well suited for engineers designing compact, rugged systems that require configurable digital logic and dense interfacing. Its 672‑FBGA surface‑mount package and industrial temperature rating help integrate advanced FPGA functionality into space‑constrained, temperature‑challenging environments.

As an Intel Cyclone 10 GX device, it is backed by documented device specifications and electrical characteristics to support engineering validation and long‑term deployment planning.

Request a quote or submit an inquiry for the 10CX105YF672I5G to obtain pricing, availability, and support for your design requirements.