10CX105YF780I5G

The 10CX105YF780I5G is an Intel Cyclone® 10 GX field programmable gate array (FPGA) supplied in a 780‑FBGA FCBGA package. This industrial‑grade device combines a high logic element count with substantial on‑chip RAM and a large I/O complement for system designs that require programmable logic density in a compact surface‑mount package.

Key hardware data includes 104,000 logic elements, 8,641,536 total RAM bits, 284 I/O pins, a 0.9 V core supply, and an operating temperature range of −40 °C to 100 °C. The device datasheet documents configuration schemes and transceiver/periphery performance specifications for system integration and timing validation.

Key Features

• Logic Capacity  104,000 logic elements provide substantial programmable logic resources for mid‑to‑high complexity designs.
• On‑Chip Memory  Total RAM capacity of 8,641,536 bits supports buffering, FIFOs, and embedded data storage without immediate reliance on external memory.
• I/O Density  284 I/O pins enable broad peripheral connectivity and interface options within a single FPGA package.
• Package & Mounting  780‑FBGA (FCBGA) package, 29 × 29 mm supplier device package, designed for surface‑mount assembly.
• Power  Core voltage specified at 0.9 V (900 mV), as listed in the product specifications.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, matching industrial application thermal requirements.
• Configuration and Performance Documentation  Datasheet includes configuration specifications (JTAG, FPP, AS, PS) and transceiver/periphery performance sections for design validation and timing analysis.
• Regulatory Compliance  RoHS compliant, as indicated in the product data.

Unique Advantages

• High logic density: 104,000 logic elements let you implement complex logic and state machines on a single device, reducing external component count.
• Substantial embedded RAM: 8,641,536 bits of on‑chip RAM support local buffering and data handling to simplify board‑level memory architecture.
• Generous I/O count: 284 I/Os accommodate multiple interfaces and parallel connections without additional I/O expanders.
• Industrial thermal range: −40 °C to 100 °C rating supports deployment in temperature‑challenging environments.
• Compact BGA package: 780‑FBGA (29 × 29 mm) offers a balance of high pin count and compact footprint for space‑constrained assemblies.
• Documented configuration and timing: Datasheet coverage of configuration schemes and timing/performance parameters aids predictable integration and validation.

Why Choose 10CX105YF780I5G?

The 10CX105YF780I5G positions itself where substantial programmable logic, on‑chip memory, and extensive I/O are required in an industrial‑grade FPGA. Its 104,000 logic elements and 8.64 Mb of RAM enable consolidation of logic and buffering tasks, while the 284 I/Os and 780‑FBGA package simplify system routing and board layout.

Choose this Cyclone® 10 GX device for designs that demand predictable industrial temperature operation, documented configuration and timing references, and RoHS compliance. The provided electrical and configuration specifications in the device datasheet support engineering validation and long‑term deployment planning.

Request a quote or submit an inquiry to receive pricing, availability, and technical support for the 10CX105YF780I5G.