10CX105YF780E5G

The 10CX105YF780E5G is a Cyclone® 10 GX field programmable gate array (FPGA) IC in a 780-BBGA FCBGA package. This extended-grade (-E5) device provides a combination of high logic density, on-chip RAM, and a large I/O count in a compact surface-mount package.

Key device attributes include 104,000 logic elements, 38,000 CLBs, 8,641,536 total RAM bits, 284 I/O pins, a 0.9 V core supply, and an operating temperature range of 0 °C to 100 °C. The datasheet documents the device’s electrical, switching, I/O timing, and configuration specifications.

Key Features

• Core & Logic — 104,000 logic elements delivered through 38,000 CLBs, enabling complex programmable logic implementations.
• On‑Chip Memory — 8,641,536 total RAM bits for buffering, packet processing, and state storage within the FPGA fabric.
• I/O Density — 284 user I/O pins to support wide connectivity and interfacing requirements.
• Package & Mounting — 780‑BBGA (780‑FBGA, FC 29×29) surface-mount package for compact board-level integration.
• Power — Core voltage supply specified at 0.9 V to match the device’s internal power requirements.
• Temperature & Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Configuration & Timing — Datasheet includes configuration specifications and timing information (POR, JTAG, FPP, AS, PS configuration timing) to support system bring-up and programming.

Unique Advantages

• High logic capacity: 104,000 logic elements and 38,000 CLBs provide the resources needed for large, integrated logic designs without external glue logic.
• Substantial on‑chip RAM: 8.64 Mbits of RAM reduces reliance on external memory for many buffering and intermediate-storage tasks.
• Generous I/O complement: 284 I/O pins allow broad peripheral and subsystem interfacing while keeping designs compact.
• Compact FCBGA packaging: 780‑FBGA (29×29) offers a dense, surface-mount footprint for space-constrained boards.
• Low-voltage core operation: 0.9 V supply minimizes core power while matching the device’s specified operating conditions.
• Documented configuration and timing: Comprehensive datasheet coverage for electrical characteristics, configuration timing, and I/O timing supports reliable integration and system validation.

Why Choose 10CX105YF780E5G?

The 10CX105YF780E5G positions itself as a high-density, on-board programmable logic solution that combines significant logic and memory resources with a large I/O complement in a compact 780‑BBGA package. Its extended-grade specification and documented configuration and timing details make it suitable for designs that require predictable operating conditions and thorough integration guidance.

This device is suited to engineers and procurement teams seeking a single-chip FPGA solution that offers scalable logic capacity, ample on-chip RAM, and a well-documented datasheet to support system bring-up and verification.

Request a quote or submit an inquiry for pricing and availability to begin integrating the 10CX105YF780E5G into your next design.