10CX105YF672E6G

The 10CX105YF672E6G is an Intel Cyclone® 10 GX FPGA in an extended-grade package optimized for mid-to-high density programmable logic applications. It integrates 104,000 logic elements and 8,641,536 bits of on-chip RAM, delivering high-capacity programmable resources in a 672‑FBGA (27 × 27 mm) surface-mount package.

This device targets designs requiring substantial logic and memory density with up to 236 user I/O pins, supported by the Cyclone 10 GX family electrical, configuration, I/O timing, and transceiver performance specifications documented in the device datasheet.

Key Features

• Core Logic  104,000 logic elements provide substantial programmable logic capacity for complex FPGA designs.
• On‑Chip Memory  8,641,536 total RAM bits for data buffering, state storage, and embedded memory implementations.
• I/O & Interfaces  236 I/O pins support flexible interfacing and system connectivity in a single-package solution.
• Package & Mounting  672‑FBGA, FCBGA supplier package in a 27 × 27 mm footprint; surface‑mount mounting type for compact board-level integration.
• Grade & Speed  Extended grade device appropriate for applications within the specified extended operating range.
• Operating Conditions  Rated for 0 °C to 100 °C ambient operating temperature and a supply voltage of 900 mV as specified.
• Configuration & Performance  Supported by Cyclone 10 GX device-level documentation covering electrical characteristics, switching characteristics, I/O timing, configuration timing, and transceiver performance specifications.
• Environmental  RoHS compliant.

Typical Applications

• High‑density logic implementations  Use the device’s 104,000 logic elements and large on‑chip RAM for complex state machines, data path processing, and protocol handling.
• Embedded system acceleration  Combine logic and memory resources to offload compute-intensive tasks or accelerate custom processing functions in embedded designs.
• Interface aggregation  Leverage 236 I/O pins to consolidate multiple digital interfaces or route high‑pin‑count peripheral connectivity through a single FPGA package.

Unique Advantages

• Substantial programmable capacity: 104,000 logic elements accommodate large logic designs without immediate part-upgrade pressure.
• Generous on‑chip memory: 8,641,536 RAM bits enable internal buffering, FIFOs, and lookup storage to simplify board-level memory requirements.
• High I/O count in compact package: 236 I/O pins in a 672‑FBGA (27 × 27 mm) form factor reduce PCB area while maintaining extensive external connectivity.
• Extended-grade rating: Specified for operation across 0 °C to 100 °C, suitable for applications that require extended-range operation.
• Datasheet-backed configuration and timing: Device documentation provides electrical, switching, configuration, and I/O timing details to support reliable system integration.
• RoHS compliant: Conforms to lead‑free manufacturing requirements for environmental compliance.

Why Choose 10CX105YF672E6G?

The 10CX105YF672E6G balances large programmable logic capacity, substantial on‑chip memory, and a high I/O count in a compact 672‑FBGA surface-mount package. Its extended-grade specification and comprehensive Cyclone 10 GX device documentation make it a practical choice for designs that need significant integration of logic, memory, and I/O while relying on documented electrical and configuration characteristics.

This part suits engineering teams building systems that require scalable programmable resources, robust on‑chip memory, and clear integration guidelines from the device datasheet, enabling predictable design implementation and verification.

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