10CX105YU484I5G
| Part Description |
Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 8641536 104000 484-BFBGA |
|---|---|
| Quantity | 629 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA | Number of I/O | 188 | Voltage | 900 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38000 | Number of Logic Elements/Cells | 104000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 8641536 |
Overview of 10CX105YU484I5G – Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 8641536 104000 484-BFBGA
The 10CX105YU484I5G is an Intel Cyclone® 10 GX FPGA in a 484-ball BFBGA package, offered in an industrial grade variant. It delivers a programmable-logic platform with 104,000 logic elements and 8,641,536 bits of on-chip RAM targeted at industrial and embedded FPGA designs.
Built around the Cyclone 10 GX architecture, this device is specified with up to 188 I/O pins, a 0.9 V core supply, and an operating temperature range of −40 °C to 100 °C, making it suitable for applications that require significant logic capacity and on-chip memory in a compact surface-mount package.
Key Features
- Logic Capacity — 104,000 logic elements providing substantial programmable logic resources for custom digital functions and control logic.
- On‑Chip Memory — 8,641,536 total RAM bits to support buffering, FIFOs, and embedded data storage without external memory.
- I/O Density — Up to 188 user I/O pins for interfacing with sensors, peripherals, and external logic.
- Package and Mounting — 484‑BFBGA package (supplier package: 484‑UBGA, 19×19) in a surface‑mount form factor for compact board integration.
- Power — Core voltage specified at 900 mV (0.9 V) for the device core supply.
- Industrial Temperature Range — Rated for −40 °C to 100 °C operation for industrial environments.
- Compliance — RoHS compliant.
- Family-Level Documentation — Datasheet material for the Cyclone 10 GX family covers electrical characteristics, switching and timing specifications, transceiver and periphery performance, and configuration timing and methods.
Typical Applications
- Industrial Control and Automation — Industrial-grade temperature rating and robust logic/memory resources enable control, sequencing, and protocol bridging in factory and process-control systems.
- Embedded Systems — On-chip RAM and abundant logic elements support custom embedded logic, data buffering, and peripheral interfacing in compact designs.
- High‑Density I/O Interfaces — 188 I/O pins provide capability for multi-channel sensor aggregation, I/O expansion, and peripheral connectivity on space-constrained PCBs.
Unique Advantages
- Substantial Logic Resources — 104,000 logic elements allow complex state machines, custom datapaths, and control logic to be implemented on a single device.
- Large On‑Chip Memory — 8.64 Mb of RAM bits reduces dependence on external memory for buffering and data processing, simplifying BOM and board layout.
- Industrial‑Grade Operation — Specified −40 °C to 100 °C operation supports deployment in temperature‑challenging environments.
- Compact BGA Package — 484‑ball BFBGA (19×19 UBGA footprint) enables high density integration while maintaining manufacturability with surface‑mount assembly.
- Standards‑Oriented Documentation — Cyclone 10 GX family datasheet coverage of electrical, timing, and configuration details aids engineering verification and system integration.
- RoHS Compliant — Aligns with common environmental and manufacturing requirements.
Why Choose 10CX105YU484I5G?
The 10CX105YU484I5G positions itself as a high-capacity, industrial‑grade Cyclone 10 GX FPGA suitable for designs that require a balance of programmable logic, embedded RAM, and versatile I/O in a compact surface-mount BGA package. Its specification set supports engineers building industrial and embedded systems that demand significant on‑chip resources and a broad operating temperature range.
Engineers and procurement teams seeking a Cyclone 10 GX device with 104,000 logic elements, 8.64 Mb of RAM, 188 I/Os, and a 484‑ball BGA footprint will find this part aligned to robust, space‑efficient FPGA implementations with family-level documentation for electrical and configuration details.
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