10CX150YF672I5G

The 10CX150YF672I5G is an Intel Cyclone® 10 GX field‑programmable gate array (FPGA) packaged in a 672‑ball BGA (FCBGA). It provides a high density of programmable logic and on‑chip RAM for industrial designs requiring configurable logic, deterministic I/O timing, and documented configuration options.

Designed as an industrial‑grade device, this FPGA includes detailed electrical, switching, transceiver and configuration specifications in the Cyclone 10 GX datasheet to support system design and integration.

Key Features

• Logic Capacity — 150,000 logic elements, enabling complex programmable logic implementations.
• Configurable Logic Blocks (CLBs) — Device family documentation provides CLB‑level details to guide synthesis and placement.
• On‑chip Memory — 10,907,648 total RAM bits for embedded buffering, state storage, and data processing.
• I/O and Interface Support — 236 user I/O pins with comprehensive I/O timing and transceiver performance specifications covered in the device datasheet.
• Package and Mounting — 672‑BBGA (FCBGA) surface‑mount package; supplier device package listed as 672‑FBGA, FC (27×27) for board‑level planning.
• Power Supply — Core supply specified at 900 mV (900 mV to 900 mV), documented in electrical characteristics.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Configuration and Initialization — Datasheet includes detailed configuration timing and initialization options (JTAG, AS, FPP, PS, and related timing specifications).
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control — Industrial‑grade temperature rating and high logic density allow implementation of control, sequencing, and custom logic functions in industrial automation equipment.
• Networking & Communications — Documented transceiver and I/O timing specifications support designs that require deterministic link behavior and high‑density I/O.
• Embedded Systems & Prototyping — Large logic and memory resources make the device suitable for embedded processing offload, custom peripherals, and hardware prototyping.

Unique Advantages

• High Logic Density: 150,000 logic elements provide room for complex FPGA designs without immediate need to migrate to larger families.
• Large On‑Chip RAM: Over 10.9 million bits of RAM for buffering, lookup tables, and on‑chip data storage reduces external memory dependence.
• Comprehensive Documentation: Cyclone 10 GX datasheet includes electrical, switching, transceiver and configuration timing details to support design verification and integration.
• Industrial Reliability: Specified operating range from −40 °C to 100 °C aligns with industrial deployment requirements.
• Compact, High‑Pin Package: 672‑ball FCBGA package enables dense board integration while exposing 236 I/Os for system connectivity.
• RoHS Compliant: Meets common materials‑compliance requirements for modern electronic products.

Why Choose 10CX150YF672I5G?

The 10CX150YF672I5G delivers a balanced combination of logic capacity, on‑chip memory, and documented I/O/transceiver behavior in an industrial‑grade FPGA package. Its 150,000 logic elements and 10,907,648 RAM bits provide the resources needed for complex control, communication, and embedded logic functions while the 672‑ball FCBGA offers high integration density.

Choose this Cyclone® 10 GX device when you need a documented, industrially rated FPGA platform with substantial logic and memory resources, deterministic I/O capability, and configuration flexibility supported by Intel's Cyclone 10 GX device datasheet.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical assistance for the 10CX150YF672I5G.