10CX150YF780I5G

The 10CX150YF780I5G is an Intel Cyclone 10 GX FPGA provided in a 780-ball FCBGA package for surface-mount assembly. It delivers high logic density with integrated on-chip RAM and a substantial I/O count for complex, configurable digital designs.

Built for industrial-grade applications, this device combines 150,000 logic elements and 10,907,648 bits of on-chip RAM with documented transceiver and I/O timing specifications to support designs that require high integration and robust operating conditions.

Key Features

• Logic Capacity  150,000 logic elements enable implementation of complex digital functions and custom hardware acceleration.
• On-Chip Memory  10,907,648 total RAM bits provide substantial on-chip storage for buffering, state machines, and data processing tasks.
• I/O Density  284 user I/O pins support wide parallel interfaces and multiple external peripherals.
• Package & Mounting  780-BBGA (FCBGA) package, supplier device package 780-FBGA (29×29), designed for surface-mount PCB assembly.
• Industrial Grade & Temperature Range  Rated as Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Supply Voltage  Core supply specified at 900 mV.
• Configuration & I/O Timing  Datasheet includes configuration timing, JTAG/FPP/AS configuration schemes, programmable I/O delay, and POR/initialization specifications for predictable startup and configuration behavior.
• Transceiver and Performance Specifications  Device documentation provides transceiver performance and switching characteristics to support high-speed serial interfaces and timing-critical designs.
• Standards Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Industrial-grade temperature rating and high logic density make this FPGA suitable for control systems requiring on-board processing and deterministic I/O.
• Networking & Communications  Documented transceiver performance and extensive I/O support enable implementation of protocol engines and interface bridges.
• Data Processing & Acceleration  Large logic capacity and nearly 11 Mbits of on-chip RAM allow custom data-paths, buffering, and real-time signal processing.
• Embedded Systems  High I/O count and configurable logic are useful for integrating multiple sensors, peripherals, and custom interfaces into a single device.

Unique Advantages

• High Logic Density: 150,000 logic elements support complex designs and consolidated functionality on a single FPGA to reduce external components.
• Substantial On-Chip Memory: 10,907,648 bits of RAM reduce reliance on external memory and improve data throughput for streaming and buffering applications.
• Extensive I/O Count: 284 I/O pins provide flexibility for parallel interfaces, multi-channel connectivity, and system expansion.
• Industrial Temperature Rating: −40 °C to 100 °C operation enables reliable performance across a wide range of field conditions.
• Surface-Mount FCBGA Package: 780-ball FCBGA (29×29) package supports high-density board layouts while maintaining manufacturability for production volumes.
• Documented Configuration & Timing: Detailed configuration, POR, and I/O timing information in the device documentation supports deterministic design and system bring-up.

Why Choose 10CX150YF780I5G?

The 10CX150YF780I5G positions itself as a high-density, industrial-grade FPGA option that brings together a large logic fabric, significant on-chip RAM, and a broad I/O complement in a production-ready FCBGA package. Its documented transceiver, configuration, and timing specifications provide the design determinism required for complex embedded and communications systems.

This device is well suited for engineering teams seeking to consolidate functionality, reduce component count, and maintain reliable operation across challenging temperature ranges while leveraging Intel Cyclone 10 GX device documentation for system-level integration.

Request a quote or submit a purchase inquiry to receive pricing and availability details for the 10CX150YF780I5G.